First Foundry Three-Dimensional Hall Effect Sensor for System-on-Chip Integration

被引：3

作者：

Toh, Eng-Huat ^{[1
]}

Sun, Yongshun ^{[1
]}

Zheng, Ping ^{[1
]}

Shajan, Mathew ^{[1
]}

Cao, Patrick ^{[1
]}

Islam, Mohd Nurul ^{[1
]}

Wong, Jian-Yi ^{[1
]}

Arikath, Praveen ^{[1
]}

Jain, Ruchil ^{[1
]}

Tan, Tam Lyn ^{[1
]}

Quek, Elgin ^{[1
]}

机构：

[1] GLOBALFOUNDRIES Singapore Pte Ltd, 60 Woodlands Ind Pk D St 2, Singapore 738406, Singapore

来源：

2020 IEEE SENSORS | 2020年

关键词：

Hall effect; Hall sensor; magnetic field sensing; sensitivity; BCDLite;

D O I：

10.1109/sensors47125.2020.9278745

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Modular three dimensional (3-D) Hall sensors are demonstrated in 180BCDLite (R) technology. It is CMOS integrated with one or two mask adders. Best-in-class current-related sensitivity S-I >385 V/A*T and voltage-related sensitivity S-V >50 mV/V*T for planar Hall devices are achieved while the vertical Hall devices are optimized independently for S-V up to 50 mV/V*T. This enables flexibility for designers to provide a System-on-Chip (SoC) and low-cost integrated solution using 3-D Hall devices.

引用

页数：3

共 50 条

[1] Three-dimensional integrated circuits and the future of system-on-chip designs
Patti, Robert S.
PROCEEDINGS OF THE IEEE, 2006, 94 (06) : 1214 - 1224
[2] Low-Power and High-Sensitivity System-on-Chip Hall Effect Sensor
Liu, Bin
Sun, Yongshun
Ding, Yinjie
Cao, Patrick
Liu, Aaron
Ong, Shiang Yang
Tiong, Michael
Cheng, Gong
Islam, Mohd Nurul
Jain, Ruchil
Tan, Tam Lyn
Quek, Elgin
Toh, Eng-Huat
2017 IEEE SENSORS, 2017, : 1188 - 1190
[3] THREE-DIMENSIONAL IMPEDANCE ENGINEERING FOR MIXED-SIGNAL SYSTEM-ON-CHIP APPLICATIONS
Chong, Kyuchul
Xie, Ya-Hong
2008 9TH INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED-CIRCUIT TECHNOLOGY, VOLS 1-4, 2008, : 1439 - 1443
[4] Three-dimensional impedance engineering for mixed-signal system-on-chip applications
Chong, K
Zhang, X
Tu, KN
Huang, DQ
Chang, MCF
Xie, YH
CICC: PROCEEDINGS OF THE IEEE 2005 CUSTOM INTEGRATED CIRCUITS CONFERENCE, 2005, : 663 - 666
[5] A Modular Three-Dimensional Hall Effect Sensor for Performance Optimization
Toh, Eng-Huat
Sun, Yongshun
Zheng, Ping
Shajan, Mathew
Cao, Patrick
Islam, Mohd Nurul
Wong, Jian-Yi
Arikath, Praveen
Jain, Ruchil
Tan, Tam Lyn
Quek, Elgin
IEEE SENSORS JOURNAL, 2022, 22 (12) : 11256 - 11263
[6] System-on-chip: Reuse and integration
Saleh, Resve
Wilton, Steve
Mirabbasi, Shahriar
Hu, Alan
Greenstreet, Mark
Lemieux, Guy
Pande, Partha Pratim
Grecu, Cristian
Ivanov, Andre
PROCEEDINGS OF THE IEEE, 2006, 94 (06) : 1050 - 1069
[7] An asynchronous hierarchical router for networks-on-chip-based three-dimensional multi-processor system-on-chip
Lafi, Walid
Lattard, Didier
Jerrya, Ahmed
SOFTWARE-PRACTICE & EXPERIENCE, 2012, 42 (07): : 877 - 890
[8] Designing an inertial measuring system using system-on-chip and sensor microsystems integration
Fito, Xavier
Kanellou, Eleni
Yi, Guo
Ferrer, Carles
2006 IEEE INTERNATIONAL SYMPOSIUM ON INDUSTRIAL ELECTRONICS, VOLS 1-7, 2006, : 3260 - +
[9] System-on-Chip SMO Gas Sensor Integration in Advanced CMOS Technology
Filipovic, Lado
Lahlalia, Ayoub
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2018, 165 (16) : B862 - B879
[10] Stress Considerations for System-on-Chip Gas Sensor Integration in CMOS Technology
Filipovic, Lado
Selberherr, Siegfried
IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2016, 16 (04) : 483 - 495

← 1 2 3 4 5 →