First Foundry Three-Dimensional Hall Effect Sensor for System-on-Chip Integration

被引：3

作者：

Toh, Eng-Huat ^{[1
]}

Sun, Yongshun ^{[1
]}

Zheng, Ping ^{[1
]}

Shajan, Mathew ^{[1
]}

Cao, Patrick ^{[1
]}

Islam, Mohd Nurul ^{[1
]}

Wong, Jian-Yi ^{[1
]}

Arikath, Praveen ^{[1
]}

Jain, Ruchil ^{[1
]}

Tan, Tam Lyn ^{[1
]}

Quek, Elgin ^{[1
]}

机构：

[1] GLOBALFOUNDRIES Singapore Pte Ltd, 60 Woodlands Ind Pk D St 2, Singapore 738406, Singapore

来源：

2020 IEEE SENSORS | 2020年

关键词：

Hall effect; Hall sensor; magnetic field sensing; sensitivity; BCDLite;

D O I：

10.1109/sensors47125.2020.9278745

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Modular three dimensional (3-D) Hall sensors are demonstrated in 180BCDLite (R) technology. It is CMOS integrated with one or two mask adders. Best-in-class current-related sensitivity S-I >385 V/A*T and voltage-related sensitivity S-V >50 mV/V*T for planar Hall devices are achieved while the vertical Hall devices are optimized independently for S-V up to 50 mV/V*T. This enables flexibility for designers to provide a System-on-Chip (SoC) and low-cost integrated solution using 3-D Hall devices.

引用

页数：3

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