Three-dimensional integration of nanotechnologies for computing and data storage on a single chip

被引：0
|
作者：
Max M. Shulaker
Gage Hills
Rebecca S. Park
Roger T. Howe
Krishna Saraswat
H.-S. Philip Wong
Subhasish Mitra
机构：
[1] Stanford University,Department of Electrical Engineering
[2] Massachusetts Institute of Technology,Department of Electrical Engineering and Computer Science
[3] Stanford University,Department of Computer Science
来源：
Nature | 2017年 / 547卷
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Multiple nanotechnologies are integrated on a single chip to realize a three-dimensional integrated circuit architecture that combines computing and data storage—a potentially transformative advance in computing.
引用
收藏
页码：74 / 78
页数：4
相关论文
共 50 条
  • [41] Three-dimensional bursting and parallel computing
    Tabik, S.
    Garzon, E. M.
    Romero, L. F.
    Ramos, J. L.
    INTERNATIONAL JOURNAL FOR MULTISCALE COMPUTATIONAL ENGINEERING, 2007, 5 (01) : 39 - 46
  • [42] COMPUTING AND VISUALIZING THREE-DIMENSIONAL QUASICRYSTALS
    Nolan, Joshua D.
    Reiter, Clifford A.
    FRACTALS-COMPLEX GEOMETRY PATTERNS AND SCALING IN NATURE AND SOCIETY, 2018, 26 (06)
  • [43] Computing the three-dimensional convex hull
    Allison, DCS
    Noga, MT
    COMPUTER PHYSICS COMMUNICATIONS, 1997, 103 (01) : 74 - 82
  • [44] Computing the three-dimensional convex hull
    Virginia Polytechnic Inst and State, Univ, Blacksburg, United States
    Comput Phys Commun, 1 (74-82):
  • [45] Highly integrated three-dimensional MMIC single-chip receiver and transmitter
    Toyoda, I
    Tokumitsu, T
    Aikawa, M
    1996 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS 1-3, 1996, : 1209 - 1212
  • [46] A novel single-chip fabrication technique for three-dimensional MEMS structures
    Pang, JT
    Zou, QB
    Tan, ZM
    Qian, X
    Liu, LT
    Li, ZJ
    1998 5TH INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED CIRCUIT TECHNOLOGY PROCEEDINGS, 1998, : 936 - 938
  • [47] Highly integrated three-dimensional MMIC single-chip receiver and transmitter
    Toyoda, I
    Tokumitsu, T
    Aikawa, M
    IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 1996, 44 (12) : 2340 - 2346
  • [48] The three-dimensional genome organization of Drosophila melanogaster through data integration
    Qingjiao Li
    Harianto Tjong
    Xiao Li
    Ke Gong
    Xianghong Jasmine Zhou
    Irene Chiolo
    Frank Alber
    Genome Biology, 18
  • [49] The three-dimensional genome organization of Drosophila melanogaster through data integration
    Li, Qingjiao
    Tjong, Harianto
    Li, Xiao
    Gong, Ke
    Zhou, Xianghong Jasmine
    Chiolo, Irene
    Alber, Frank
    GENOME BIOLOGY, 2017, 18
  • [50] Three-Dimensional Flexible-Module Placement for Stacked Three-Dimensional Integration
    Noguchi, Tomohiro
    Hindawi, Omran
    Kaneko, Mineo
    2022 IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS (ISCAS 22), 2022, : 3260 - 3264
12345