Three-dimensional integration of nanotechnologies for computing and data storage on a single chip

被引：0
|
作者：
Max M. Shulaker
Gage Hills
Rebecca S. Park
Roger T. Howe
Krishna Saraswat
H.-S. Philip Wong
Subhasish Mitra
机构：
[1] Stanford University,Department of Electrical Engineering
[2] Massachusetts Institute of Technology,Department of Electrical Engineering and Computer Science
[3] Stanford University,Department of Computer Science
来源：
Nature | 2017年 / 547卷
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Multiple nanotechnologies are integrated on a single chip to realize a three-dimensional integrated circuit architecture that combines computing and data storage—a potentially transformative advance in computing.
引用
收藏
页码：74 / 78
页数：4
相关论文
共 50 条
  • [21] Overview and Outlook of Three-Dimensional Integrated Circuit Packaging, Three-Dimensional Si Integration, and Three-Dimensional Integrated Circuit Integration
    Lau, John H.
    JOURNAL OF ELECTRONIC PACKAGING, 2014, 136 (04)
  • [22] Chip-to-wafer three-dimensional integration technology for retinal prosthesis chips
    Kikuchi, Hircrazu
    Yamada, Yusuke
    Fukushima, Takafumi
    Tanaka, Tetsu
    Koyanagi, Mitsumasa
    FUTURE MEDICAL ENGINEERING BASED ON BIONANOTECHNOLOGY, PROCEEDINGS, 2006, : 385 - +
  • [23] A complete three-dimensional sound intensity sensor integrated on a single chip
    Yntema, D. R.
    van Honschoten, J. W.
    Wiegerink, R. J.
    Elwenspoek, M.
    JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2008, 18 (11)
  • [24] Three-dimensional silicon integration
    Knickerbocker, J. U.
    Andry, P. S.
    Dang, B.
    Horton, R. R.
    Interrante, M. J.
    Patel, C. S.
    Polastre, R. J.
    Sakuma, K.
    Sirdeshmukh, R.
    Sprogis, E. J.
    Sri-Jayantha, S. M.
    Stephens, A. M.
    Topol, A. W.
    Tsang, C. K.
    Webb, B. C.
    Wright, S. L.
    IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 2008, 52 (06) : 553 - 569
  • [25] Three-dimensional silicon integration
    Knickerbocker, John U.
    Andry, Paul S.
    Dang, Bing
    Horton, Raymond R.
    Interrante, Mario J.
    Patel, Chirag S.
    Polastre, Robert J.
    Sakuma, Katsuyuki
    Sirdeshmukh, Ranjani
    Sprogis, Edmund J.
    Sri-Jayantha, Sri M.
    Stephens, Antonio M.
    Topol, Anna W.
    Tsang, Cornelia K.
    Webb, Bucknell C.
    Wright, Steven L.
    IBM Journal of Research and Development, 2008, 52 (06): : 553 - 569
  • [26] Three-dimensional optical data storage using photochromic materials
    Kawata, S
    Kawata, Y
    CHEMICAL REVIEWS, 2000, 100 (05) : 1777 - 1788
  • [27] Three-dimensional error correction schemes for holographic data storage
    Hwang, E
    Yoon, P
    Park, JY
    Park, JY
    Nam, H
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, 2005, 44 (5B): : 3529 - 3533
  • [28] Microholograms recorded in a thermoplastic medium for three-dimensional data storage
    Dubois, Marc
    Shi, Xiaolei
    Erben, Christoph
    Lawrence, Brian
    Boden, Eugene
    Longley, Kathryn
    Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers, 1600, 45 (2 B): : 1239 - 1245
  • [29] Microholograms recorded in a thermoplastic medium for three-dimensional data storage
    Dubois, M
    Shi, XL
    Erben, C
    Lawrence, B
    Boden, E
    Longley, K
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, 2006, 45 (2B): : 1239 - 1245
  • [30] Three-dimensional data storage using the photochromic protein bacteriorhodopsin
    Marcy, D
    Tetley, W
    Stuart, J
    Birge, R
    PROCEEDINGS OF THE 22ND ANNUAL INTERNATIONAL CONFERENCE OF THE IEEE ENGINEERING IN MEDICINE AND BIOLOGY SOCIETY, VOLS 1-4, 2000, 22 : 1003 - 1006
12345