Low temperature bonding for 3D integration FOREWORD

被引：0
|
作者：
Fujino, Masahisa [1 ]
机构：
[1] Natl Inst Adv Ind Sci & Technol, Tokyo, Japan
来源：
JAPANESE JOURNAL OF APPLIED PHYSICS | 2022年 / 61卷 / SF期
关键词：
D O I：
10.35848/1347-4065/ac65d8
中图分类号：
O59 [应用物理学];
学科分类号：
摘要：
引用
收藏
页数：1
相关论文
共 50 条
  • [31] Development and Electrical Performance of Low Temperature Cu-Sn/In Bonding for 3D Flexible Substate Integration
    Hu, Yu-Chen
    Chen, Kuan-Neng
    2016 IEEE SILICON NANOELECTRONICS WORKSHOP (SNW), 2016, : 164 - 165
  • [32] Surface Passivation of Cu for Low Temperature 3D Wafer Bonding
    Lim, D. F.
    Wei, J.
    Leong, K. C.
    Tan, C. S.
    ECS SOLID STATE LETTERS, 2012, 1 (01) : P11 - P14
  • [33] Low temperature metal bonding for 3D and power device packaging
    Di Cioccio, L.
    Beilliard, Y.
    Mermoz, S.
    Estevez, R.
    Coudrain, P.
    Moreau, S.
    Widiez, J.
    2014 4TH IEEE INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D), 2014, : 59 - 59
  • [34] Surface smoothing of Au plated films by template stripping towards low-temperature bonding for 3D integration
    Thu, Le Hac Huong
    Matsumae, Takashi
    Kurashima, Yuichi
    Takagi, Hideki
    Higurashi, Eiji
    2021 7TH INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D), 2021, : 6 - 6
  • [35] Asymmetric Low Temperature Bonding Structure Using Ultra-thin Buffer Layer Technique for 3D Integration
    Liang, Hao-Wen
    Yu, Ting-Yang
    Chang, Yao-Jen
    Chen, Kuan-Neng
    PROCEEDINGS OF THE 2016 IEEE 23RD INTERNATIONAL SYMPOSIUM ON THE PHYSICAL AND FAILURE ANALYSIS OF INTEGRATED CIRCUITS (IPFA), 2016, : 312 - 315
  • [36] Sequential 3D Process Integration: Opportunities For Low Temperature Processing
    Kerdiles, S.
    Acosta-Alba, P.
    Mathieu, B.
    Veillerot, M.
    Denis, H.
    Aussenac, F.
    Mazzamuto, F.
    Toque-Tresonne, I.
    Huet, K.
    Samson, M-P.
    Previtali, B.
    Brunet, L.
    Batude, P.
    Fenouillet-Beranger, C.
    SEMICONDUCTOR PROCESS INTEGRATION 10, 2017, 80 (04): : 215 - 225
  • [37] 3D Integration Applications for Low Temperature Direct Bond Technology
    Enquist, Paul
    2014 4TH IEEE INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D), 2014, : 8 - 8
  • [38] Design Benefits of Hybrid Bonding for 3D Integration
    Nigussie, Theodros
    Pan, Tse-Han
    Lipa, Steve
    Pitts, W. Shepherd
    DeLaCruz, Javi
    Franzon, Paul
    IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021), 2021, : 1876 - 1881
  • [39] Wafer bonding for 3D integration of MEMS/CMOS
    Gracias, Alison
    Castracane, Jarnes
    Xu, Bai
    RELIABILITY, PACKAGING, TESTING, AND CHARACTERIZATION OF MEMS/ MOEMS V, 2006, 6111
  • [40] Wafer and Die Bonding Technologies for 3D Integration
    Farrens, Shari
    MATERIALS AND TECHNOLOGIES FOR 3-D INTEGRATION, 2009, 1112 : 55 - 65
12345