Surface smoothing of Au plated films by template stripping towards low-temperature bonding for 3D integration

被引：1
|
作者：
Thu, Le Hac Huong [1 ]
Matsumae, Takashi [1 ]
Kurashima, Yuichi [1 ]
Takagi, Hideki [1 ]
Higurashi, Eiji [1 ]
机构：
[1] Natl Inst Adv Ind Sci & Technol, Tsukuba, Ibaraki 3058568, Japan
来源：
2021 7TH INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D) | 2021年
关键词：
D O I：
10.1109/LTB-3D53950.2021.9598356
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
This study reports the smoothing of rough Au surfaces fabricated by electroless plating by multiple thin film transfer process based on the template stripping method. The formation of ultrasmooth Au with Ra surface roughness of less than 1.0 nm was obtained, which results in surfaces suitable for bonding of Au/Au at low temperature.
引用
收藏
页码：6 / 6
页数：1
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