Low temperature bonding for 3D integration FOREWORD

被引：0
|
作者：
Fujino, Masahisa [1 ]
机构：
[1] Natl Inst Adv Ind Sci & Technol, Tokyo, Japan
来源：
JAPANESE JOURNAL OF APPLIED PHYSICS | 2022年 / 61卷 / SF期
关键词：
D O I：
10.35848/1347-4065/ac65d8
中图分类号：
O59 [应用物理学];
学科分类号：
摘要：
引用
收藏
页数：1
相关论文
共 50 条
  • [1] Low Temperature Bonding for 3D Integration FOREWORD
    Suga, Tadatomo
    Shigekawa, Naoteru
    Higurashi, Eiji
    Shimatsu, Takehito
    Sugiyama, Masakazu
    Takagi, Hideki
    Toyoda, Noriaki
    JAPANESE JOURNAL OF APPLIED PHYSICS, 2018, 57 (02)
  • [2] Low Temperature Bonding for 3D Integration FOREWORD
    Shigekawa, Naoteru
    Takagi, Hideki
    Fujino, Masahisa
    Higurashi, Eiji
    Nishiyama, Nobuhiko
    Shimatsu, Takehito
    Toyoda, Noriaki
    JAPANESE JOURNAL OF APPLIED PHYSICS, 2020, 59 (SB)
  • [3] Low temperature bonding technology for 3D integration
    Ko, Cheng-Ta
    Chen, Kuan-Neng
    MICROELECTRONICS RELIABILITY, 2012, 52 (02) : 302 - 311
  • [4] Low Temperature Cu/In Bonding for 3D Integration
    Panchenko, Iuliana
    Bickel, Steffen
    Meyer, Joerg
    Mueller, Maik
    Wolf, Juergen M.
    2017 5TH INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D), 2017, : 17 - 17
  • [5] Low Temperature Hybrid Wafer Bonding for 3D Integration
    Damian, A. A.
    Poelma, R. H.
    van Zeijl, H. W.
    Zhang, G. Q.
    2013 14TH INTERNATIONAL CONFERENCE ON THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS (EUROSIME), 2013,
  • [6] Low Temperature Bonding with Thin Wafers for 3D Integration
    Matthias, T.
    Kim, B.
    Kettner, P.
    Wimplinger, M.
    Lindner, P.
    CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE 2011 (CSTIC 2011), 2011, 34 (01): : 1023 - 1028
  • [7] Investigation of Low Temperature Cu/In Bonding in 3D Integration
    Hsieh, Yu-Sheng
    Shen, Ting-Ting
    Chien, Yu-San
    Chen, Kuan-Neng
    Shinozaki, Yuko
    Kawasaki, Naohiko
    PROCEEDINGS OF THE 2015 IEEE INTERNATIONAL CONFERENCE ON ELECTRON DEVICES AND SOLID-STATE CIRCUITS (EDSSC), 2015, : 383 - 386
  • [8] Low temperature copper-nanorod bonding for 3D integration
    Wang, Pei-, I
    Karabacak, Tansel
    Yu, Jian
    Li, Hui-Fen
    Pethuraja, Gopal G.
    Lee, Sang Hwui
    Liu, Michael Z.
    Lu, J. -Q.
    Lu, T. -M.
    ENABLING TECHNOLOGIES FOR 3-D INTEGRATION, 2007, 970 : 225 - +
  • [9] Low Temperature (<180 °C) Bonding for 3D Integration
    Huang, Yan-Pin
    Tzeng, Ruoh-Ning
    Chien, Yu-San
    Shy, Ming-Shaw
    Lin, Teu-Hua
    Chen, Kou-Hua
    Chuang, Ching-Te
    Hwang, Wei
    Chiu, Chi-Tsung
    Tong, Ho-Ming
    Chen, Kuan-Neng
    2013 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC), 2013,
  • [10] Advances in Low-Temperature Bonding Technologies for 3D Integration
    Suga, Tadatomo
    Shigekawa, Naoteru
    Higurashi, Eiji
    Takagi, Hideki
    Shimomura, Kazuhiko
    JAPANESE JOURNAL OF APPLIED PHYSICS, 2015, 54 (03)
12345