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- [41] Board Level Solder Joint Reliability Model for Flip-Chip Ball Grid Array Packages under Compressive Loads 2010 12TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2010, : 646 - 651
- [43] Comprehensive model for on-chip power grid transient analysis and power grid-induced noise prediction 55TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, 2005 PROCEEDINGS, 2005, : 716 - 721
- [45] Effect of lid materials on the solder ball reliability of thermally enhanced flip-chip plastic ball grid array packages FRACTURE AND STRENGTH OF SOLIDS VI, PTS 1 AND 2, 2006, 306-308 : 1043 - 1048
- [46] Analysis of fatigue delamination growth in flip-chip package Acta Mechanica, 2014, 225 : 2761 - 2773
- [49] Analysis of New Direct on PCB Board Attached High Power Flip-Chip LEDs 2015 IEEE 65TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2015, : 1310 - 1317
- [50] Dynamic analysis of flip-chip self-alignment IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2005, 28 (03): : 475 - 480