Fast flip-chip power grid analysis via locality and grid shells

被引:96
|
作者
Chiprout, E [1 ]
机构
[1] Strateg CAD, Intel Labs, Chandler, AZ USA
关键词
D O I
10.1109/ICCAD.2004.1382626
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
Full-chip power grid analysis is time consuming. Several techniques have been proposed to tackle the problem but typically they deal with the power grid as a whole or partition at unnatural boundaries. Using a locality effect under flip-chip packaging, we propose a natural partitioning approach based on overlapping power grid "shells". The technique makes more efficient any previous simulation techniques that are polynomial in grid size. It is also parallelizable and therefore extremely fast. Using complete partitions gives no loss of accuracy compared to a full matrix solution, while lesser partitions are conservative for droop and current. Results on a recent Pentium((R)) microprocessor design show excellent speed and accuracy.
引用
收藏
页码:485 / 488
页数:4
相关论文
共 50 条
  • [31] Power distribution fidelity of wirebond compared to flip chip devices in grid array packages
    Hashemi, H
    Herrell, DJ
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1997, 20 (03): : 272 - 278
  • [32] Thermal analysis of a flip chip ceramic ball grid array (CBGA) package
    Kandasamy, Ravi
    Mujumdar, A. S.
    MICROELECTRONICS RELIABILITY, 2008, 48 (02) : 261 - 273
  • [33] Fast Analysis of On-Chip Power Grid Circuits by Extended Truncated Balanced Realization Method
    Li, Duo
    Tan, Sheldon X. -D.
    IEICE TRANSACTIONS ON FUNDAMENTALS OF ELECTRONICS COMMUNICATIONS AND COMPUTER SCIENCES, 2009, E92A (12) : 3061 - 3069
  • [34] A novel joint-in-via, flip-chip chip-scale package
    Lee, TK
    Zhang, S
    Wong, CC
    Tan, AC
    54TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2004, : 1209 - 1215
  • [35] A novel joint-in-via flip-chip chip-scale package
    Lee, TK
    Zhang, S
    Wong, CC
    Tan, AC
    IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2006, 29 (01): : 186 - 194
  • [36] 40 GHz hot-via flip-chip interconnects
    Schmückle, FJ
    Jentzsch, A
    Gässler, C
    Marschall, P
    Geiger, D
    Heinrich, W
    2003 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS 1-3, 2003, : 1167 - 1170
  • [37] Flip-chip flex-circuit packaging for power electronics
    Xiao, Y
    Natarajan, R
    Jain, P
    Barrett, J
    Rymaszewski, EJ
    Gutmann, RJ
    Chow, TP
    ISPSD'01: PROCEEDINGS OF THE 13TH INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES & ICS, 2001, : 55 - 58
  • [38] High-Brightness InGaNGaN Power Flip-Chip LEDs
    Chang, Shoou-Jinn
    Chen, W. S.
    Shei, S. C.
    Kuo, C. T.
    Ko, T. K.
    Shen, C. F.
    Tsai, J. M.
    Lai, Wei-Chi
    Sheu, Jinn-Kong
    Lin, A. J.
    JOURNAL OF LIGHTWAVE TECHNOLOGY, 2009, 27 (12) : 1985 - 1989
  • [39] Fast power grid simulation
    Nassif, SR
    Kozhaya, JN
    37TH DESIGN AUTOMATION CONFERENCE, PROCEEDINGS 2000, 2000, : 156 - 161
  • [40] Through-Silicon via Submount for Flip-Chip LEDs
    Lu, Chun-Liang
    Chang, Shoou-Jinn
    Chen, Wei-Shou
    Hsueh, Ting-Jen
    ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, 2017, 6 (12) : R159 - R162