共 50 条
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- [27] A Fast Approximation Technique for Power Grid Analysis 2011 16TH ASIA AND SOUTH PACIFIC DESIGN AUTOMATION CONFERENCE (ASP-DAC), 2011,
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- [30] Power distribution fidelity of wirebond compared to flip chip devices in grid array packages ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING - IEEE 5TH TOPICAL MEETING, 1996, : 24 - 26