Annealing of paramagnetic defects introduced in SIMOX by ion implantation

被引:0
|
作者
Suzuki, A [1 ]
Yamaguchi, M [1 ]
Nakamura, H [1 ]
Izumi, T [1 ]
Kakizaki, Y [1 ]
Onda, T [1 ]
Hara, T [1 ]
机构
[1] Tokai Univ, Dept Elect, Hiratsuka, Kanagawa 25912, Japan
关键词
D O I
暂无
中图分类号
O59 [应用物理学];
学科分类号
摘要
Defects produced in the top Si layer of silicon on insulator (SOI) by As+ implantation has been investigated, using electron spin resonance (ESR) method. We observed two kinds of ESR centers. One had a g-value of 2.0054, Delta H-pp=6.5 Oe, which originated from Si dangling bond in amorphous layer (a-center). The other had a g-value of 2.0010, Delta H-pp=4.5 Oe, which is due to E'-center in SiO2 layer. The g-value of the a-center shifted from 2.0054 to 2.0045 at the annealing temperature above 700 degrees C.
引用
收藏
页码:147 / 152
页数:6
相关论文
共 50 条
  • [41] Plasma immersion ion implantation for SOI synthesis: SIMOX and ion-cut
    Lu, X
    Iyer, SSK
    Lee, J
    Doyle, B
    Fan, ZN
    Chu, PK
    Hu, CM
    Cheung, NW
    JOURNAL OF ELECTRONIC MATERIALS, 1998, 27 (09) : 1059 - 1066
  • [42] Ion implantation and annealing technology
    Wang, Jingyi
    Weixi Jiagong Jishu/Microfabrication Technology, 1994, (01): : 51 - 57
  • [43] ION-IMPLANTATION AND ANNEALING
    RIMINI, E
    VACUUM, 1988, 38 (11) : 1053 - 1053
  • [44] Effect of ion-induced defects and oxygen concentration in annealing atmosphere on formation of buried oxide layer in SIMOX materials
    Chen, J
    Wang, X
    Jin, B
    Zhang, E
    Sun, J
    Wang, X
    SEMICONDUCTOR SCIENCE AND TECHNOLOGY, 2005, 20 (03) : 305 - 309
  • [45] Formation of Extended Defects in 4H-SiC Induced by Ion Implantation/Annealing
    Nagano, M.
    Tsuchida, H.
    Suzuki, T.
    Hatakeyama, T.
    Senzaki, J.
    Fukuda, K.
    SILICON CARBIDE AND RELATED MATERIALS 2008, 2009, 615-617 : 477 - 480
  • [46] ANNEALING OF DEFECTS BY NANOSECOND LASER-PULSES AFTER IMPLANTATION OF SMALL ION DOSES
    KACHURIN, GA
    NIDAEV, EV
    DANYUSHKINA, NV
    SOVIET PHYSICS SEMICONDUCTORS-USSR, 1980, 14 (04): : 386 - 388
  • [47] Microstructural evolution and defects in ultra-thin SIMOX materials during annealing
    Jeoung, JS
    Evans, R
    Seraphin, S
    SILICON MATERIALS-PROCESSING, CHARACTERIZATION AND RELIABILITY, 2002, 716 : 9 - 15
  • [48] Annealing effect on boron high-energy-ion-implantation-induced defects in Si
    Hsu, Wei-Cheng
    Liang, Mong-Song
    Chen, Shih-Chang
    Chen, Mao-Chieh
    Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers, 2004, 43 (8 A): : 5231 - 5234
  • [49] RESIDUAL DEFECTS IN SILICON AFTER AS+ION IMPLANTATION AT SELF-ANNEALING REGIMES
    KOMAROV, FF
    KOTOV, EV
    NOVIKOV, AP
    PETROV, SA
    CHITKO, VI
    RADIATION EFFECTS AND DEFECTS IN SOLIDS, 1987, 105 (1-2): : 79 - 84
  • [50] Advanced microwave ion source for 100mA-class SIMOX ion implantation
    Tokiguchi, K
    Seki, T
    Amemiya, K
    Yamashita, Y
    ION IMPLANTATION TECHNOLOGY - 96, 1997, : 287 - 290