Heterogeneous 3-D ICs as a platform for hybrid energy harvesting in IoT systems

被引:7
|
作者
Vaisband, Boris [1 ]
Friedman, Eby G. [2 ]
机构
[1] Univ Calif Los Angeles, Dept Elect & Comp Engn, Los Angeles, CA 90095 USA
[2] Univ Rochester, Dept Elect & Comp Engn, Rochester, NY 14627 USA
来源
FUTURE GENERATION COMPUTER SYSTEMS-THE INTERNATIONAL JOURNAL OF ESCIENCE | 2018年 / 87卷
基金
美国国家科学基金会;
关键词
3-D IC; Internet of things; Hybrid energy harvesting; Heterogeneous integration;
D O I
10.1016/j.future.2018.04.092
中图分类号
TP301 [理论、方法];
学科分类号
081202 ;
摘要
Three-dimensional integrated circuits are a natural platform for IoT systems. IoT systems exhibit a small footprint, integrate disparate technologies, and require long term sustainability (extremely low power or self-powered). A hybrid energy harvesting system within a three-dimensional integrated circuit is proposed in this paper. The harvesting system exploits different types of energy available from the ambient (electromagnetic, solar, thermal, and kinetic). Integration of the hybrid harvesting system onto a three-dimensional platform ensures that each type of harvested energy can be individually collected. Both static and dynamic evaluations of a hybrid energy harvesting system are provided. For an example IoT system, the static power requirements are approximately 85% of the power delivered to the load. In the dynamic evaluation, a range of activity factors characterizing the load and different storage capacitors are considered. The power requirements of a typical IoT system are shown to be satisfied by a hybrid energy harvesting system within a 3-D platform. (C) 2018 Elsevier B.V. All rights reserved.
引用
收藏
页码:152 / 158
页数:7
相关论文
共 50 条
  • [41] SOC Test Architecture and Method for 3-D ICs
    Lo, Chih-Yen
    Hsing, Yu-Tsao
    Denq, Li-Ming
    Wu, Cheng-Wen
    IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS, 2010, 29 (10) : 1645 - 1649
  • [42] Thermal Conduction Path Analysis in 3-D ICs
    Vaisband, Boris
    Savidis, Ioannis
    Friedman, Eby G.
    2014 IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS (ISCAS), 2014, : 594 - 597
  • [43] Scaling trends of power noise in 3-D ICs
    Xu, Kan
    Friedman, Eby G.
    INTEGRATION-THE VLSI JOURNAL, 2015, 51 : 139 - 148
  • [44] Temperature Sensing RRAM Architecture for 3-D ICs
    Merkel, Cory E.
    Kudithipudi, Dhireesha
    IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, 2014, 22 (04) : 878 - 887
  • [45] Synchronization and Power Integrity Issues in 3-D ICs
    Pavlidis, Vasilis F.
    Xu, Hu
    Tsioutsios, Ioannis
    De Micheli, Giovanni
    PROCEEDINGS OF THE 2010 IEEE ASIA PACIFIC CONFERENCE ON CIRCUIT AND SYSTEM (APCCAS), 2010, : 536 - 539
  • [46] Hierarchical Test Integration Methodology for 3-D ICs
    Chou, Che-Wei
    Li, Jin-Fu
    Yu, Yun-Chao
    Lo, Chih-Yen
    Kwai, Ding-Ming
    Chou, Yung-Fa
    IEEE DESIGN & TEST, 2015, 32 (04) : 59 - 70
  • [47] Harnessing Heterogeneity for Targeted Attacks on 3-D ICs
    Aversa, Alec
    Savidis, Ioannis
    PROCEEDING OF THE GREAT LAKES SYMPOSIUM ON VLSI 2024, GLSVLSI 2024, 2024, : 246 - 251
  • [48] Hexagonal TSV Bundle Topology for 3-D ICs
    Vaisband, Boris
    Friedman, Eby G.
    IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS, 2017, 64 (01) : 11 - 15
  • [49] AC coupled interconnect for dense 3-D ICs
    Xu, J
    Mick, S
    Wilson, J
    Luo, L
    Chandrasekar, K
    Erickson, E
    Franzon, PD
    2003 IEEE NUCLEAR SCIENCE SYMPOSIUM, CONFERENCE RECORD, VOLS 1-5, 2004, : 125 - 129
  • [50] Fabrication Cost Analysis for Contactless 3-D ICs
    Papistas, Ioannis A.
    Pavlidis, Vasilis F.
    Velenis, Dimitrios
    IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS, 2019, 66 (05) : 758 - 762