ESD protection design challenges for a high pin-count alpha microprocessor in a 0.13 μm CMOS SOI technology

被引:0
|
作者
Juliano, PA
Anderson, WR
机构
[1] Shrewsbury, MA 01545
[2] Intel Massachussetts, Hudson, MA 01749
关键词
ESD; SOI; CMOS; design; microprocessor;
D O I
10.1016/j.elstat.2004.04.008
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We illustrate the complexity of designing ESD protection for a 64-bit microprocessor employing 140 million transistors. This IC contains 901 I/O signals, most operating at > 1 Gbit/s/pin, and 10 power supplies split into 27 domains. An extensive set of CAD tools used to expedite ESD-related chip assembly and to analyze finished layout is described. (C) 2004 Elsevier B.V. All rights reserved.
引用
收藏
页码:113 / 131
页数:19
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  • [3] Electrostatic discharge (ESD) protection in silicon-on-insulator (SOI) CMOS technology with aluminum and copper interconnects in advanced microprocessor semiconductor chips
    Voldman, S
    Hui, D
    Warriner, L
    Young, D
    Howard, J
    Assaderaghi, F
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    Shahidi, G
    [J]. JOURNAL OF ELECTROSTATICS, 2000, 49 (3-4) : 151 - 168
  • [5] High voltage resistant ESD protection circuitry for 0.5μm CMOS OTP/EPROM programming pin
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  • [6] High Voltage resistant ESD protection circuitry for 0.5μm CMOS OTP/EPROM programming pin
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    Walker, P
    Mendicino, M
    Yeap, G
    Foisy, M
    Cox, K
    Cartwright, J
    Venkatesan, S
    [J]. 2003 IEEE INTERNATIONAL SOI CONFERENCE, PROCEEDINGS, 2003, : 41 - 42
  • [8] Influence of body contact on the ESD protection performance in 0.35μm Partially-Depleted SOI Salicided CMOS Technology
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    Steinbeck, L.
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