共 50 条
- [1] Ultra High Density Logic Designs Using Transistor-Level Monolithic 3D Integration 2012 IEEE/ACM INTERNATIONAL CONFERENCE ON COMPUTER-AIDED DESIGN (ICCAD), 2012, : 539 - 546
- [2] Energy-Efficient Adiabatic Circuits Using Transistor-Level Monolithic 3D Integration 2020 IEEE 33RD INTERNATIONAL SYSTEM-ON-CHIP CONFERENCE (SOCC), 2020, : 191 - 194
- [3] A 14nm Finfet Transistor-Level 3D Partitioning Design to Enable High-Performance and Low-Cost Monolithic 3D IC 2016 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM), 2016,
- [4] Power Benefit Study for Ultra-High Density Transistor-Level Monolithic 3D ICs 2013 50TH ACM / EDAC / IEEE DESIGN AUTOMATION CONFERENCE (DAC), 2013,
- [5] Transistor-Level Monolithic 3D Standard Cell Layout Optimization for Full-Chip Static Power Integrity 2017 IEEE/ACM INTERNATIONAL SYMPOSIUM ON LOW POWER ELECTRONICS AND DESIGN (ISLPED), 2017,
- [6] On the Design of Ultra-High Density 14nm Finfet based Transistor-Level Monolithic 3D ICs 2016 IEEE COMPUTER SOCIETY ANNUAL SYMPOSIUM ON VLSI (ISVLSI), 2016, : 449 - 454
- [7] Gate Sizing for Power-Delay Optimization at Transistor-level Monolithic 3D-Integrated Circuits 2020 IEEE 11TH LATIN AMERICAN SYMPOSIUM ON CIRCUITS & SYSTEMS (LASCAS), 2020,
- [8] Stability/Performance Assessment of Monolithic 3D 6T/ST SRAM Cells Considering Transistor-Level Interlayer Coupling PROCEEDINGS OF TECHNICAL PROGRAM - 2014 INTERNATIONAL SYMPOSIUM ON VLSI TECHNOLOGY, SYSTEMS AND APPLICATION (VLSI-TSA), 2014,
- [9] New Thermal Management Approach for Transistor-level 3-D Integtration 2017 IEEE SOI-3D-SUBTHRESHOLD MICROELECTRONICS TECHNOLOGY UNIFIED CONFERENCE (S3S), 2017,
- [10] An Effective Analytical 3D Placer in Monolithic 3D IC Designs PROCEEDINGS OF 2015 IEEE 11TH INTERNATIONAL CONFERENCE ON ASIC (ASICON), 2015,