Stability/Performance Assessment of Monolithic 3D 6T/ST SRAM Cells Considering Transistor-Level Interlayer Coupling

被引:0
|
作者
Fan, Ming-Long [1 ,2 ]
Hu, Vita Pi-Ho [1 ,2 ]
Chen, Yin-Nien [1 ,2 ]
Su, Pin [1 ,2 ]
Chuang, Ching-Te [1 ,2 ]
机构
[1] Natl Chiao Tung Univ, Dept Elect Engn, Hsinchu, Taiwan
[2] Natl Chiao Tung Univ, Inst Elect, Hsinchu, Taiwan
来源
PROCEEDINGS OF TECHNICAL PROGRAM - 2014 INTERNATIONAL SYMPOSIUM ON VLSI TECHNOLOGY, SYSTEMS AND APPLICATION (VLSI-TSA) | 2014年
关键词
D O I
暂无
中图分类号
TP [自动化技术、计算机技术];
学科分类号
0812 ;
摘要
In this work, we investigate the impact of interlayer coupling on monolithic 3D 6T/8T SRAM cells with various layouts and tier combinations. Our results indicate that for 3D 6T SRAM cell with NFET in top layer, aligning upper-tier pull-down NFET with bottom-tier pull-up PFET enables better cell stability. For monolithic 3D 8T cell, an area-efficient 4N4P design is evaluated with optimized two-tier layout to enhance cell performance. We find that stacking NFET layer over the PFET tier results in larger design margins for SRAM cell stability and performance.
引用
收藏
页数:2
相关论文
共 23 条
  • [1] Stability and Performance Optimization of Heterochannel Monolithic 3-D SRAM Cells Considering Interlayer Coupling
    Fan, Ming-Long
    Hu, Vita Pi-Ho
    Chen, Yin-Nien
    Su, Pin
    Chuang, Ching-Te
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2014, 61 (10) : 3448 - 3455
  • [2] Investigation and Optimization of Monolithic 3D Logic Circuits and SRAM Cells Considering Interlayer Coupling
    Fan, Ming-Long
    Hu, Vita Pi-Ho
    Chen, Yin-Nien
    Su, Pin
    Chuang, Ching-Te
    2014 IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS (ISCAS), 2014, : 1130 - 1133
  • [3] Transistor-Level Camouflaged Logic Locking Method for Monolithic 3D IC Security
    Dofe, Jaya
    Yan, Chen
    Kontak, Scott
    Salman, Emre
    Yu, Qiaoyan
    PROCEEDINGS OF THE 2016 IEEE ASIAN HARDWARE ORIENTED SECURITY AND TRUST SYMPOSIUM (ASIANHOST 2016), 2016,
  • [4] Ultra High Density Logic Designs Using Transistor-Level Monolithic 3D Integration
    Lee, Young-Joon
    Morrow, Patrick
    Lim, Sung Kyu
    2012 IEEE/ACM INTERNATIONAL CONFERENCE ON COMPUTER-AIDED DESIGN (ICCAD), 2012, : 539 - 546
  • [5] Energy-Efficient Adiabatic Circuits Using Transistor-Level Monolithic 3D Integration
    Miketic, Ivan
    Salman, Emre
    2020 IEEE 33RD INTERNATIONAL SYSTEM-ON-CHIP CONFERENCE (SOCC), 2020, : 191 - 194
  • [6] Investigation of BTI Reliability for Monolithic 3D 6T SRAM with Ultra-thin-body GeOI MOSFETs
    Hu, Vita Pi-Ho
    Su, Pin
    Chuang, Ching-Te
    2016 IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS (ISCAS), 2016, : 2106 - 2109
  • [7] Dense N over CMOS 6T SRAM Cells using 3D Sequential Integration
    Lu, C-M. V.
    Fenouillet-Beranger, C.
    Brocard, M.
    Billoint, O.
    Cibrario, G.
    Brunet, L.
    Garros, X.
    Leroux, C.
    Casse, M.
    Laurent, A.
    Toffoli, A.
    Romano, G.
    Kies, R.
    Gassilloud, R.
    Rambal, N.
    Lapras, V.
    Samson, M-P.
    Tallaron, C.
    Tabone, C.
    Previtali, B.
    Barge, D.
    Ayres, A.
    Pasini, L.
    Besombes, P.
    Andrieu, F.
    Batude, P.
    Skotnicki, T.
    Vinet, M.
    2017 INTERNATIONAL SYMPOSIUM ON VLSI TECHNOLOGY, SYSTEMS AND APPLICATION (VLSI-TSA), 2017,
  • [8] Power Benefit Study for Ultra-High Density Transistor-Level Monolithic 3D ICs
    Lee, Young-Joon
    Limbrick, Daniel
    Lim, Sung Kyu
    2013 50TH ACM / EDAC / IEEE DESIGN AUTOMATION CONFERENCE (DAC), 2013,
  • [9] A 14nm Finfet Transistor-Level 3D Partitioning Design to Enable High-Performance and Low-Cost Monolithic 3D IC
    Shi, Jiajun
    Nayak, Deepak
    Banna, Srinivasa
    Fox, Robert
    Samavedam, Srikanth
    Samal, Sandeep
    Lim, Sung Kyu
    2016 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM), 2016,
  • [10] Transistor-Level Monolithic 3D Standard Cell Layout Optimization for Full-Chip Static Power Integrity
    Ku, Bon Woong
    Song, Taigon
    Nieuwoudt, Arthur
    Lim, Sung Kyu
    2017 IEEE/ACM INTERNATIONAL SYMPOSIUM ON LOW POWER ELECTRONICS AND DESIGN (ISLPED), 2017,