Transistor-Level Camouflaged Logic Locking Method for Monolithic 3D IC Security

被引:0
|
作者
Dofe, Jaya [1 ]
Yan, Chen [2 ]
Kontak, Scott [2 ]
Salman, Emre [2 ]
Yu, Qiaoyan [1 ]
机构
[1] Univ New Hampshire, Dept Elect & Comp Engn, Durham, NH 03824 USA
[2] SUNY Stony Brook, Dept Elect & Comp Engn, Stony Brook, NY 11794 USA
来源
PROCEEDINGS OF THE 2016 IEEE ASIAN HARDWARE ORIENTED SECURITY AND TRUST SYMPOSIUM (ASIANHOST 2016) | 2016年
关键词
Hardware security; logic locking; logic encryption; reverse engineering; IP piracy; monolithic 3D ICs;
D O I
暂无
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
This work proposes a novel method for transistor-level logic locking to address intellectual property (IP) piracy and reverse engineering attacks in monolithic three-dimensional (M3D) ICs. The proposed method locks logic gates by independently inserting parallel or serial locking transistors and camouflaged contacts in multiple tiers in M3D ICs. Without the correct key bits and confidential information for camouflaged contacts, the locked logic gates will malfunction and significantly alter power profiles, which makes reverse engineering attacks more difficult. The performance overhead of the proposed method is evaluated with ISCAS'85 benchmark circuits synthesized and placed with a customized M3D IC library. Case study on c6288 benchmark circuit shows that the proposed locking method with the correct key increases the power by only 0.26%. On average, this method consumes 2.3% more transistors than the baseline ISCAS'85 benchmark circuits.
引用
收藏
页数:6
相关论文
共 50 条
  • [41] Monolithic 3D Compute-in-Memory Accelerator with BEOL Transistor based Reconfigurable Interconnect
    Luo, Yandong
    Dutta, Sourav
    Kaul, Ankit
    Lim, Sung-kyu
    Bakir, Muhannad
    Datta, Suman
    Yu, Shimeng
    2021 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM), 2021,
  • [42] 3D IC stacking technology for reducing power consumption of logic LSI system
    Aoyagi M.
    Kikuchi K.
    Journal of Japan Institute of Electronics Packaging, 2019, 22 (05): : 374 - 379
  • [43] RS3DPlace: Monolithic 3D IC placement using Reinforcement Learning and Simulated Annealing
    Mansoor, Abdullah
    Chrzanowska-Jeske, Malgorzata
    2022 IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS (ISCAS 22), 2022, : 394 - 398
  • [44] SkyBridge-3D-CMOS 2.0: IC Technology for Stacked-Transistor 3D ICs beyond FinFETs
    Bhat, Sachin
    Li, Mingyu
    Ghosh, Shaun
    Kulkarni, Sourabh
    Moritz, Csaba Andras
    2021 IEEE COMPUTER SOCIETY ANNUAL SYMPOSIUM ON VLSI (ISVLSI 2021), 2021, : 176 - 181
  • [45] New approach to block-level 3D IC layout design
    Grzesiak-Kopec, Katarzyna
    Ogorzalek, Maciej
    2014 IEEE 5TH LATIN AMERICAN SYMPOSIUM ON CIRCUITS AND SYSTEMS (LASCAS), 2014,
  • [46] A Thermal-Aware Distribution Method of TSV in 3D IC
    Hou, Ligang
    Fu, Jingyan
    Wang, Jinhui
    Gong, Na
    Zhao, Wei
    Geng, Shuqin
    PROCEEDINGS OF 2015 IEEE 11TH INTERNATIONAL CONFERENCE ON ASIC (ASICON), 2015,
  • [47] Micro-bumping, Hybrid Bonding, or Monolithic? A PPA Study for Heterogeneous 3D IC Options
    Kim, Jinwoo
    Zhu, Lingjun
    Torun, Hakki Mert
    Swaminathan, Madhavan
    Lim, Sung Kyu
    2021 58TH ACM/IEEE DESIGN AUTOMATION CONFERENCE (DAC), 2021, : 1189 - 1194
  • [48] Electrical Coupling and Simulation of Monolithic 3D Logic Circuits and Static Random Access Memory
    Ahn, Tae Jun
    Choi, Bum Ho
    Lim, Sung Kyu
    Yu, Yun Seop
    MICROMACHINES, 2019, 10 (10)
  • [49] Investigation and Optimization of Monolithic 3D Logic Circuits and SRAM Cells Considering Interlayer Coupling
    Fan, Ming-Long
    Hu, Vita Pi-Ho
    Chen, Yin-Nien
    Su, Pin
    Chuang, Ching-Te
    2014 IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS (ISCAS), 2014, : 1130 - 1133
  • [50] A FULL 3D PRINTING METHOD FOR MONOLITHIC INTEGRATION OF AN ACCELEROMETER AND A FORCE SENSOR
    Liu, Guandong
    Wang, Changhai
    Wang, Kexin
    Jia, Zhili
    Luo, Ruiqi
    Ma, Wei
    2023 IEEE 36TH INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, MEMS, 2023, : 598 - 601