共 50 条
- [41] Monolithic 3D Compute-in-Memory Accelerator with BEOL Transistor based Reconfigurable Interconnect 2021 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM), 2021,
- [42] 3D IC stacking technology for reducing power consumption of logic LSI system Journal of Japan Institute of Electronics Packaging, 2019, 22 (05): : 374 - 379
- [43] RS3DPlace: Monolithic 3D IC placement using Reinforcement Learning and Simulated Annealing 2022 IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS (ISCAS 22), 2022, : 394 - 398
- [44] SkyBridge-3D-CMOS 2.0: IC Technology for Stacked-Transistor 3D ICs beyond FinFETs 2021 IEEE COMPUTER SOCIETY ANNUAL SYMPOSIUM ON VLSI (ISVLSI 2021), 2021, : 176 - 181
- [45] New approach to block-level 3D IC layout design 2014 IEEE 5TH LATIN AMERICAN SYMPOSIUM ON CIRCUITS AND SYSTEMS (LASCAS), 2014,
- [46] A Thermal-Aware Distribution Method of TSV in 3D IC PROCEEDINGS OF 2015 IEEE 11TH INTERNATIONAL CONFERENCE ON ASIC (ASICON), 2015,
- [47] Micro-bumping, Hybrid Bonding, or Monolithic? A PPA Study for Heterogeneous 3D IC Options 2021 58TH ACM/IEEE DESIGN AUTOMATION CONFERENCE (DAC), 2021, : 1189 - 1194
- [49] Investigation and Optimization of Monolithic 3D Logic Circuits and SRAM Cells Considering Interlayer Coupling 2014 IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS (ISCAS), 2014, : 1130 - 1133
- [50] A FULL 3D PRINTING METHOD FOR MONOLITHIC INTEGRATION OF AN ACCELEROMETER AND A FORCE SENSOR 2023 IEEE 36TH INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS, MEMS, 2023, : 598 - 601