A SPICE COMPATIBLE MODEL OF ON-WAFER COUPLED INTERCONNECTS FOR CMOS RFICS

被引：9

作者：

Shi, X. ^{[1
]}

Yeo, K. S. ^{[1
]}

Lim, W. M. ^{[1
]}

Do, M. A. ^{[1
]}

Boon, C. C. ^{[1
]}

机构：

[1] Nanyang Technol Univ, Sch EEE, Singapore 639798, Singapore

来源：

PROGRESS IN ELECTROMAGNETICS RESEARCH-PIER | 2010年 / 102卷

关键词：

CHIP INTERCONNECTS; SILICON SUBSTRATE; LINES;

D O I：

10.2528/PIER10010608

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper investigates the properties of the on-wafer coupled interconnects built in a 0.18 mu m CMOS technology for RF applications. A SPICE compatible equivalent circuit model is developed. The proposed model is an extension of a 2-Pi equivalent circuit model for single-line interconnects by adding two coupling components. The model parameters are extracted from four-port S-parameter simulation results through a calibrated electromagnetic (EM) simulator, i.e. HFSS. The accuracy of the model is validated from 500 MHz to 20 GHz.

引用

页码：287 / 299

页数：13

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