A SPICE COMPATIBLE MODEL OF ON-WAFER COUPLED INTERCONNECTS FOR CMOS RFICS

被引：9
|
作者：
Shi, X. [1 ]
Yeo, K. S. [1 ]
Lim, W. M. [1 ]
Do, M. A. [1 ]
Boon, C. C. [1 ]
机构：
[1] Nanyang Technol Univ, Sch EEE, Singapore 639798, Singapore
来源：
PROGRESS IN ELECTROMAGNETICS RESEARCH-PIER | 2010年 / 102卷
关键词：
CHIP INTERCONNECTS; SILICON SUBSTRATE; LINES;
D O I：
10.2528/PIER10010608
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper investigates the properties of the on-wafer coupled interconnects built in a 0.18 mu m CMOS technology for RF applications. A SPICE compatible equivalent circuit model is developed. The proposed model is an extension of a 2-Pi equivalent circuit model for single-line interconnects by adding two coupling components. The model parameters are extracted from four-port S-parameter simulation results through a calibrated electromagnetic (EM) simulator, i.e. HFSS. The accuracy of the model is validated from 500 MHz to 20 GHz.
引用
收藏
页码：287 / 299
页数：13
相关论文
共 50 条
  • [11] CMOS compatible through wafer interconnects for medical imaging detectors
    Vogtmeier, G.
    Drabe, C.
    Dorscheid, R.
    Steadman, R.
    Jeroch, W.
    2007 IEEE NUCLEAR SCIENCE SYMPOSIUM CONFERENCE RECORD, VOLS 1-11, 2007, : 3430 - +
  • [12] CMOS compatible 2T pixel for on-wafer in-situ EUV detection
    Lin, Wei-Hwa
    Huang, Han-Lin
    Wu, Pin-Jiun
    Lin, Chrong-Jung
    King, Ya-Chin
    DISCOVER NANO, 2023, 18 (01)
  • [13] CMOS compatible 2T pixel for on-wafer in-situ EUV detection
    Wei-Hwa Lin
    Han-Lin Huang
    Pin-Jiun Wu
    Chrong-Jung Lin
    Ya-Chin King
    Discover Nano, 18
  • [14] Silicon micromachined interconnects for on-wafer packaging of MEMS devices
    Margomenos, A
    Peroulis, D
    Becker, JP
    Katehi, LPB
    2001 TOPICAL MEETING ON SILICON MONOLITHIC INTEGRATED CIRCUITS IN RF SYSTEMS, DIGEST OF PAPERS, 2001, : 33 - 36
  • [15] In-circuit testing of complex circuits using on-wafer probing and electromagnetic coupled ground interconnects
    Kassner, J.
    Menzel, W.
    IEEE MTT-S International Microwave Symposium Digest, 2000, 3 : 1863 - 1866
  • [16] In-circuit testing of complex circuits using on-wafer probing and electromagnetic coupled ground interconnects
    Kassner, J
    Menzel, W
    2000 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM DIGEST, VOLS 1-3, 2000, : 1863 - 1866
  • [17] A SPICE compatible subcircuit model for lateral bipolar transistors in a CMOS process
    MacSweeney, D
    McCarthy, KG
    Mathewson, A
    Mason, B
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 1998, 45 (09) : 1978 - 1984
  • [18] Passive spice-compatible models of dispersive interconnects
    Pasha, S
    Celik, M
    Cangellaris, AC
    Prince, JL
    49TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1999 PROCEEDINGS, 1999, : 493 - 499
  • [19] Passive spice-compatible models of dispersive interconnects
    Pasha, S.
    Celik, M.
    Cangellaris, A.C.
    Prince, J.L.
    Proceedings - Electronic Components and Technology Conference, 1999, : 493 - 499
  • [20] Fabrication of on-wafer MMIC compatible integrated NiCr loads
    Elgaid, K
    Edgar, DL
    Ferguson, SM
    Beaumont, SP
    Thayne, IG
    MICROELECTRONIC ENGINEERING, 2001, 57-8 : 801 - 806
12345