Effect of cooling rate on microstructure and shear strength of pure Sn, Sn-0.7Cu, Sn-3.5Ag, and Sn-37Pb solders

被引：18
|
作者：
Maveety, JG [1 ]
Liu, P [1 ]
Vijayen, J [1 ]
Hua, F [1 ]
Sanchez, EA [1 ]
机构：
[1] Intel Corp, Santa Clara, CA 95054 USA
来源：
JOURNAL OF ELECTRONIC MATERIALS | 2004年 / 33卷 / 11期
关键词：
eutectic Sn-37Pb; Sn-0.7Cu; Sn-3.5Ag; intermetallic compounds; ultimate shear strength;
D O I：
10.1007/s11664-004-0165-z
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The microstructure and shear strength characteristics of pure Sn and the eutectic compositions of Sn-37Pb, Sn-0.7Cu, and Sn-3.5Ag prepared under identical reflow conditions but subjected to two different cooling conditions were evaluated at room temperature. For the four solders, the ultimate shear strength increased with increasing strain rate from 10(-5) s(-1) to 10(-1) s(-1). Decreasing the cooling rate tended to decrease the ultimate shear strength for both the Sn-0.7Cu and Sn-3.5Ag solders. The effects of work hardening resulting from increased strain rate were more prevalent in quench-cooled (QC) samples.
引用
收藏
页码：1355 / 1362
页数：8
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