Miniature creep testing for Sn-37Pb and Sn-3.5Ag solders

被引：0
|
作者：
Takada, Akio [1 ]
Sakane, Masao [1 ]
Tsukada, Yutaka [1 ]
机构：
[1] Maizuru Natl Coll Technol, Dept Mech Engn, Kyoto 6258511, Japan
来源：
Proceedings of the ASME Materials Division | 2005年 / 100卷
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D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
This paper studies the effect of specimen diameter on creep and creep rupture time for Sn-37Pb and Sn-3.5Ag solders. Creep tests using miniature specimens with gage diameters ranging from 7.5 and 0.3 mm were carried out at 313 K and the effect of specimen diameter was discussed. The scatter of the creep rupture time was increased with decreasing the specimen diameter. The rupture ductility was decreased by the reduction of the diameter but the reduction of area did not decreased. This indicats that the reduction of area at local parts caused the larger scatter of rupture time for the miniature specimens.
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页码：265 / 269
页数：5
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