Shear strength of Sn-3.5Ag solder and Sn-3.5Ag/Cu joint

被引：0
|
作者：
Luo, Zhongbing [1 ]
Wang, Lai [1 ]
Gao, Yanjun [1 ]
Zhao, Jie [1 ]
机构：
[1] Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China
来源：
TRANSFERABILITY AND APPLICABILITY OF CURRENT MECHANICS APPROACHES | 2009年
关键词：
Sn-3.5Ag; Sn-3.5Ag/Cu; Strain sensitivity; Shear; Fracture; STRAIN-RATE; SN-AG; TENSILE PROPERTIES; COOLING RATE; TEMPERATURE; ALLOYS; MICROSTRUCTURE; BEHAVIOR;
D O I：
暂无
中图分类号：
TH [机械、仪表工业];
学科分类号：
0802 ;
摘要：
The multiscale microstructures and shear properties of Sn-3.5Ag at different cooling rates and Sn-3.5Ag/Cu joint have been studied. Results show that when the cooling rate decreased from 3.5K/s to 1.0K/s, short-needlelike bulk Ag3Sn intermetallic compounds (IMCs) formed and dispersed homogeneously in matrix. Simultaneously, eutectic region was refined. Linear increasing relationship on log-log plot was obtained between shear strength and shear strain rate for all samples. The shear strength of Sn-3.5Ag solder at fast cooling rate was higher than that at a slow cooling rate, but both were smaller than that of joint. The strain sensitivity exponent m for bulk solders at 1.0K/s, 3.5K/s and joint was 0.094, 0.076 and 0.082, respectively. Fractography analysis indicated all the solder samples, and Sn-3.5Ag/Cu joint at low strain rates (0.1rad/s and 1rad/s), exhibited ductile fracture no matter what cooling rate. At high strain rate (10rad/s), broken Cu6Sn5 were found in the fractography of Sn-3.5Ag/Cu joint. However, the main part of the fractography was still composed of dimples, which indicated mixed fracture happened.
引用
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页码：511 / 515
页数：5
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