TSV Repairing for 3D ICs using Redundant TSV

被引：0

作者：

Ghosh, Sudeep ^{[1
]}

Roy, Surajit Kumar ^{[2
]}

Rahaman, Hafizur ^{[2
]}

Giri, Chandan ^{[2
]}

机构：

[1] Gurunanak Inst Technol, Dept Informat Technol, Kolkata 700114, India

[2] Indian Inst Engn Sci & Technol, Dept Informat Technol, Sibpur 711103, Howrah, India

来源：

2017 7TH INTERNATIONAL SYMPOSIUM ON EMBEDDED COMPUTING AND SYSTEM DESIGN (ISED) | 2017年

关键词：

redundant TSV; faulty TSV; MUX; dependency;

D O I：

暂无

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

Three dimensional integrated circuit (3D IC) based on through-silicon-via (TSV) is gaining significant importance in semiconductor industry. During manufacturing process there may have some faulty TSVs. Recovery of these faulty TSVs is necessary for a reliable TSV based system. Use of redundant TSVs to recover faulty TSVs is an attractive solution for repairing faulty TSV. Proper grouping of functional and redundant TSVs and efficient techniques of signal shifting through redundant TSVs can improve the recovery rate of faulty TSVs. In this paper, we propose a methodology to make connection between functional TSVs and redundant TSVs for re-route the signal using multiplexers (MUXs) in such a way that required number of MUXs will be minimum and dependency will be maximum.

引用

页数：5

共 50 条

[21] 3D TSV and Interposer
Fraunhofer, Juergen Wolf
2012 IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE (IITC), 2012,
[22] Disconnection Failure Model and Analysis of TSV-based 3D ICs
Jung, Daniel H.
Kim, Joohee
Kim, Heegon
Kim, Jonghoon J.
Kim, Joungho
Pak, Jun So
2012 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS SYMPOSIUM (EDAPS), 2012, : 164 - 167
[23] On Effective and Efficient In-Field TSV Repair for Stacked 3D ICs
Jiang, Li
Ye, Fangming
Xu, Qiang
Chakrabarty, Krishnendu
Eklow, Bill
2013 50TH ACM / EDAC / IEEE DESIGN AUTOMATION CONFERENCE (DAC), 2013,
[24] Algorithms for TSV resource sharing and optimization in designing 3D stacked ICs
Lee, Byunghyun
Kim, Taewhan
INTEGRATION-THE VLSI JOURNAL, 2014, 47 (02) : 184 - 194
[25] TSV Power Supply Array Electromigration Lifetime Analysis in 3D ICs
Zou, Qiaosha
Zhang, Tao
Xu, Cong
Xie, Yuan
GLSVLSI'14: PROCEEDINGS OF THE 2014 GREAT LAKES SYMPOSIUM ON VLSI, 2014, : 239 - 240
[26] A novel efficient TSV built-in test for stacked 3D ICs
Guibane, Badi
Hamdi, Belgacem
Bensalem, Brahim
Mtibaa, Abdellatif
TURKISH JOURNAL OF ELECTRICAL ENGINEERING AND COMPUTER SCIENCES, 2018, 26 (04) : 1909 - 1921
[27] Modeling and optimization of noise coupling in TSV-based 3D ICs
Zhao, Yingbo
Yang, Yintang
Dong, Gang
IEICE ELECTRONICS EXPRESS, 2014, 11 (20):
[28] Recovery-aware Proactive TSV Repair for Electromigration in 3D ICs
Wang, Shengcheng
Zhao, Hongyang
Tan, Sheldon X. -D.
Tahoori, Mehdi B.
PROCEEDINGS OF THE 2017 DESIGN, AUTOMATION & TEST IN EUROPE CONFERENCE & EXHIBITION (DATE), 2017, : 220 - 225
[29] Investigation of TSV noise coupling in 3D-ICs using an experimental validated 3D TSV circuit model including Si substrate effects and TSV capacitance inversion behavior after wafer thinning
Sun, X.
Rack, M.
Van der Plasl, G.
Stucchi, M.
De Vos, J.
Absil, P.
Raskin, J-P
Beyne, E.
2016 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM (IMS), 2016,
[30] 3D System Package Architecture as Alternative to 3D Stacking of ICs with TSV at System Level
Tummala, Rao R.
2017 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM), 2017,

← 1 2 3 4 5 →