TSV Repairing for 3D ICs using Redundant TSV

被引：0

作者：

Ghosh, Sudeep ^{[1
]}

Roy, Surajit Kumar ^{[2
]}

Rahaman, Hafizur ^{[2
]}

Giri, Chandan ^{[2
]}

机构：

[1] Gurunanak Inst Technol, Dept Informat Technol, Kolkata 700114, India

[2] Indian Inst Engn Sci & Technol, Dept Informat Technol, Sibpur 711103, Howrah, India

来源：

2017 7TH INTERNATIONAL SYMPOSIUM ON EMBEDDED COMPUTING AND SYSTEM DESIGN (ISED) | 2017年

关键词：

redundant TSV; faulty TSV; MUX; dependency;

D O I：

暂无

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

Three dimensional integrated circuit (3D IC) based on through-silicon-via (TSV) is gaining significant importance in semiconductor industry. During manufacturing process there may have some faulty TSVs. Recovery of these faulty TSVs is necessary for a reliable TSV based system. Use of redundant TSVs to recover faulty TSVs is an attractive solution for repairing faulty TSV. Proper grouping of functional and redundant TSVs and efficient techniques of signal shifting through redundant TSVs can improve the recovery rate of faulty TSVs. In this paper, we propose a methodology to make connection between functional TSVs and redundant TSVs for re-route the signal using multiplexers (MUXs) in such a way that required number of MUXs will be minimum and dependency will be maximum.

引用

页数：5

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