Automated handling of ultra-thin silicon wafers

被引：0

作者：

Schraub, FAT

机构：

[1] Stanford University, San Luis Obispo, CA, United States

来源：

SOLID STATE TECHNOLOGY | 2002年 / 45卷 / 09期

关键词：

Automated handling - Thinning - Ultrathin silicon wafers - Warp;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Many emerging semiconductor-manufacturing production applications are calling for wafer thinning to less than 100mum. Handling these paper thin disks, especially with automation, is no trivial task. Thin wafers have unusual degrees of bow and warp, sag from gravity, stick together, flutter in a breeze, have razor-sharp edges, and cannot be placed in conventional cassettes.

引用

页码：59 / +

页数：5

共 50 条

[1] Mechanical lapping, handling and transfer of ultra-thin wafers
Lab d'Analyse et d'Architecture des, Systemas du CNRS, Toulouse, France
J Micromech Microengineering, 4 (338-342):
[2] Mechanical lapping, handling and transfer of ultra-thin wafers
Pinel, S
Tasselli, J
Bailbé, JP
Marty, A
Puech, P
Estève, D
JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 1998, 8 (04) : 338 - 342
[3] A study on the diamond grinding of ultra-thin silicon wafers
Zhou, L.
Tian, Y. B.
Huang, H.
Sato, H.
Shimizu, J.
PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART B-JOURNAL OF ENGINEERING MANUFACTURE, 2012, 226 (B1) : 66 - 75
[4] Experimental Investigation of Ultra-Thin Silicon Wafers Warpage
Wu, Mei Ling
Tseng, Tzu Chi
2021 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP 2021), 2021, : 107 - 108
[5] Simulation Method of Ultra-Thin Silicon Wafers Warpage
Wu, Mei-Ling
Wong, Wei-Jhih
PROCEEDINGS OF THE NINETEENTH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM 2020), 2020, : 1134 - 1138
[6] A critical review on the fracture of ultra-thin photovoltaics silicon wafers
Cheng, Dameng
Gao, Yufei
SOLAR ENERGY MATERIALS AND SOLAR CELLS, 2024, 274
[7] Preparation and characterization of ultra-thin amphiphobic coatings on silicon wafers
Mou, Chun-Yueh
Yuan, Wei-Li
Shih, Chih-Hsin
THIN SOLID FILMS, 2013, 537 : 202 - 207
[8] Direct Bonding and Debonding of Glass Wafers for Handling of Ultra-thin Glass Sheets
Takeuchi, Kai
Fujino, Masahisa
Suga, Tadatomo
2016 International Conference on Electronics Packaging (ICEP), 2016, : 298 - 301
[9] Multiphysical modeling of nanosecond laser dicing on ultra-thin silicon wafers
Galasso, G.
Kaltenbacher, M.
Karunamurthy, B.
Eder, H.
Polster, T.
2014 15TH INTERNATIONAL CONFERENCE ON THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS (EUROSIME), 2014,
[10] Bondability and surface roughness of ultra-thin single crystal silicon wafers
Beggans, M
Farmer, K
Federici, J
Digges, TG
Garofalini, S
Hensley, D
SEMICONDUCTOR WAFER BONDING: SCIENCE, TECHNOLOGY, AND APPLICATIONS IV, 1998, 36 : 64 - 71

← 1 2 3 4 5 →