Automated handling of ultra-thin silicon wafers

被引：0

作者：

Schraub, FAT

机构：

[1] Stanford University, San Luis Obispo, CA, United States

来源：

SOLID STATE TECHNOLOGY | 2002年 / 45卷 / 09期

关键词：

Automated handling - Thinning - Ultrathin silicon wafers - Warp;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Many emerging semiconductor-manufacturing production applications are calling for wafer thinning to less than 100mum. Handling these paper thin disks, especially with automation, is no trivial task. Thin wafers have unusual degrees of bow and warp, sag from gravity, stick together, flutter in a breeze, have razor-sharp edges, and cannot be placed in conventional cassettes.

引用

页码：59 / +

页数：5

共 50 条

[31] Fabrication of Ultra-thin Silicon PIN Detector
Yu, Min
Dong, Xianshan
Li, Ying
Tian, Dayu
Wang, Jinyan
Jin, Yufeng
INTERNATIONAL SYMPOSIUM ON PHOTOELECTRONIC DETECTION AND IMAGING 2011: SENSOR AND MICROMACHINED OPTICAL DEVICE TECHNOLOGIES, 2011, 8191
[32] Fabrication of ultra-thin strained silicon on insulator
T. S. Drake
C. Ní Chléirigh
M. L. Lee
A. J. Pitera
E. A. Fitzgerald
D. A. Antoniadis
D. H. Anjum
J. Li
R. Hull
N. Klymko
J. L. Hoyt
Journal of Electronic Materials, 2003, 32 : 972 - 975
[33] Temporary bonding enables new processes requiring ultra-thin wafers
Webb, Richard
SOLID STATE TECHNOLOGY, 2010, 53 (02) : 10 - 12
[34] Ultra thin silicon films directly bonded onto silicon wafers
Fournel, F
Moriceau, H
Magnea, N
Eymery, J
Rouvière, JL
Rousseau, K
Aspar, B
MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY, 2000, 73 (1-3): : 42 - 46
[35] Tribological properties of ultra-thin ionic liquid films on single-crystal silicon wafers with functionalized surfaces
Yu, Bo
Zhou, Feng
Mu, Zonggang
Liang, Yongmin
Liu, Weimin
TRIBOLOGY INTERNATIONAL, 2006, 39 (09) : 879 - 887
[36] Laser assisted micro-welding of ultra-thin glass wafers
Hevonkorpi, V.
Lunden, H.
Maattanen, A.
LASER-BASED MICRO AND NANOPROCESSING X, 2016, 9736
[37] Ultra-Thin Silicon Wafers Fabrication and Inverted Pyramid Texturing Based on Cu-Catalyzed Chemical Etching
Altyeb Ali Abaker Omer
Zudong He
Shihao Hong
Yuanchih Chang
Jie Yu
Shaoyuan Li
Wenhui Ma
Wen Liu
Wael El Kolaly
Ran Chen
Silicon, 2021, 13 : 351 - 359
[38] Ultra-Thin Silicon Wafers Fabrication and Inverted Pyramid Texturing Based on Cu-Catalyzed Chemical Etching
Omer, Altyeb Ali Abaker
He, Zudong
Hong, Shihao
Chang, Yuanchih
Yu, Jie
Li, Shaoyuan
Ma, Wenhui
Liu, Wen
El Kolaly, Wael
Chen, Ran
SILICON, 2021, 13 (02) : 351 - 359
[39] Development of a Distributed Bernoulli Gripper for Ultra-thin Wafer Handling
Liu, Dong
Liang, Wenyu
Zhu, Haiyue
Teo, Chek Sing
Tan, Kok Kiong
2017 IEEE INTERNATIONAL CONFERENCE ON ADVANCED INTELLIGENT MECHATRONICS (AIM), 2017, : 265 - 270
[40] Use of ultra-thin organic silane films for the improvement of gold adhesion to the silicon dioxide wafers for (bio)sensor applications
Ben Ali, M.
Bessueille, F.
Chovelon, J. M.
Abdelghani, A.
Jaffrezic-Renault, N.
Maaref, M. A.
Martelet, C.
MATERIALS SCIENCE & ENGINEERING C-BIOMIMETIC AND SUPRAMOLECULAR SYSTEMS, 2008, 28 (5-6): : 628 - 632

← 1 2 3 4 5 →