Automated handling of ultra-thin silicon wafers

被引：0

作者：

Schraub, FAT

机构：

[1] Stanford University, San Luis Obispo, CA, United States

来源：

SOLID STATE TECHNOLOGY | 2002年 / 45卷 / 09期

关键词：

Automated handling - Thinning - Ultrathin silicon wafers - Warp;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Many emerging semiconductor-manufacturing production applications are calling for wafer thinning to less than 100mum. Handling these paper thin disks, especially with automation, is no trivial task. Thin wafers have unusual degrees of bow and warp, sag from gravity, stick together, flutter in a breeze, have razor-sharp edges, and cannot be placed in conventional cassettes.

引用

页码：59 / +

页数：5

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