Fabrication and Characterization of Electrical Interconnects and Microfluidic Cooling for 3D ICS With Silicon Interposer

被引：6
|
作者：
Oh, Hanju [1 ]
Zhang, Yue [1 ]
Zheng, Li [1 ]
May, Gary S. [1 ]
Bakir, Muhannad S. [1 ]
机构：
[1] Georgia Inst Technol, Sch Elect & Comp Engn, 791 Atlantic Dr NW,Pettit Bldg, Atlanta, GA 30332 USA
来源：
HEAT TRANSFER ENGINEERING | 2016年 / 37卷 / 11期
关键词：
HEAT-TRANSFER; 3-D ICS; DESIGN; FLOW; OPTIMIZATION; PERFORMANCE; FINS;
D O I：
10.1080/01457632.2015.1097753
中图分类号：
O414.1 [热力学];
学科分类号：
摘要：
Heat generation in high-performance three-dimensional integrated circuits (3D ICs) is a significant challenge due to limited heat removal paths and high power density. To address this challenge, this paper presents an embedded microfluidic heat sink (MFHS) for such high-performance 3D ICs. In the proposed 3D IC system, each tier contains an embedded MFHS, along with high-aspect-ratio (23:1) through-silicon vias (TSVs) routed through the MFHS. In each tier, solder-based electrical and fluidic inputs/outputs are co-fabricated with wafer-level batch fabrication. Moreover, microfluidic cooling experiments of staggered micropin-fins with embedded TSVs are presented for the first time.
引用
收藏
页码：903 / 911
页数：9
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