Effectiveness of thermal redistribution layer in cooling of 3D ICs

被引：1
|
作者：
Wang, Fengjuan [1 ]
Li, Yue [1 ]
Yu, Ningmei [1 ]
Yang, Yuan [1 ]
机构：
[1] Xian Univ Technol, Sch Automat & Informat Engn, Xian 710048, Peoples R China
来源：
INTERNATIONAL JOURNAL OF NUMERICAL MODELLING-ELECTRONIC NETWORKS DEVICES AND FIELDS | 2021年 / 34卷 / 03期
基金：
中国国家自然科学基金;
关键词：
redistribution layer (RDL); thermal management; three‐ dimensional integrated circuits (3D ICs); through‐ silicon via (TSV); THROUGH-SILICON; TEMPERATURE; MODEL; TSV; OPTIMIZATION; SIMULATION; EFFICIENT; NETWORK; FILTER;
D O I：
10.1002/jnm.2847
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A cooling system composed of a thermal redistribution layer (TRDL) and a thermal through-silicon via (TTSV) is proposed for three-dimensional integrated circuits (3D ICs). According to the Fourier heat flow analysis theory, the heat flow model of the proposed cooling system is established and verified by finite element analysis (FEA). It is shown that the maximum error between the heat flow model and FEA is 2.98%, and the maximum temperature of 3D ICs can be reduced by 4.43 degrees C. The established horizontal heat dissipation channel can effectively solve the heat dissipation problem in 3D ICs.
引用
收藏
页数：10
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