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Thermal sensor design for 3D ICs

被引：0
|
作者：
Kashfi, Fatemeh [1 ]
Draper, Jeff [1 ]
机构：
[1] Information Science Institute, University of Southern California, Marina del Rey, CA 90292, United States
来源：
Midwest Symposium on Circuits and Systems | 2012年
关键词：
Compilation and indexing terms; Copyright 2025 Elsevier Inc;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Integrated circuit design - Thermal management (electronics) - Electronics packaging - Timing circuits - Temperature control
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页码：482 / 485
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