Design and Modeling for 3D ICs and Interposers

被引：0
|
作者：
Swaminathan, Madhavan [1 ]
Han, Ki Jin [2 ]
机构：
[1] Georgia Institute of Technology, United States
[2] Ulsan National Institute of Science and Technology (UNIST), Korea, Republic of
来源：
WSPC Series in Advanced Integration and Packaging | 2013年 / 2卷
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页码：1 / 379
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