Effects of underfill delamination and chip size on the reliability of solder bumped flip chip on board

被引：0
|
作者：
Lau, JH [1 ]
Lee, SWR [1 ]
Ouyang, C [1 ]
机构：
[1] Express Packaging Syst Inc, Palo Alto, CA 94303 USA
来源：
1999 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, PROCEEDINGS | 1999年 / 3906卷
关键词：
imperfect underfill; flip chip; delamination; fracture mechanics; reliability;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The reliability of solder bumped flip chip on printed circuit board (PCB) with a perfect underfill encapsulant has been demonstrated by many researchers. In this study, the effects of delamination crack between the underfill encapsulant and the solder mask on the reliability of solder bumped flip chip on PCB are investigated by a fracture mechanic method. Emphasis is placed on the effects of chip size on the solder joint reliability of flip chip on PCB with perfect and imperfect underfills and without underfill. The energy release rates at the crack tip between the underfill and the solder mask and the inelastic temperature-dependent stress and strains at the corner solder joint for all the cases considered are provided for a better understanding of the thermal-mechanical behavior of the perfect and imperfect underfilled flip chip assemblies.
引用
收藏
页码：592 / 598
页数：7
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