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- [22] Materials to integrate the solder reflow and underfill encapsulation processes for flip chip on board assembly IEEE transactions on components, packaging and manufacturing technology. Part C. Manufacturing, 1998, 21 (01): : 57 - 65
- [23] Interfacial delamination analysis at chip/underfill interface and investigation of its effect on flip-chip's reliability 2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2013, : 954 - 958
- [24] Development of no-flow underfill materials for lead-free solder bumped flip-chip applications IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2001, 24 (01): : 59 - 66
- [25] Development of no-flow underfill materials for lead-free solder bumped flip-chip applications INTERNATIONAL SYMPOSIUM ON ADVANCED PACKAGING MATERIALS: PROCESSES, PROPERTIES AND INTERFACES, PROCEEDINGS, 2000, : 278 - 284
- [26] Influence of different modeling approaches for solder and underfill on the reliability assessment of flip chip assemblies MICRO MATERIALS, PROCEEDINGS, 2000, : 1158 - 1160
- [27] A fracture mechanics analysis of underfill delamination in flip chip packages Advances in Electronic Packaging 2005, Pts A-C, 2005, : 1341 - 1346
- [28] Mechanical fatigue test method for chip/underfill delamination in flip-chip packages IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2002, 25 (03): : 217 - 222
- [30] Analysis of underfill encapsulation curing deformations on Flip Chip On Board (FCOB) package reliability J Electron Manuf, 3 (181-191):