Effects of underfill delamination and chip size on the reliability of solder bumped flip chip on board

被引：0
|
作者：
Lau, JH [1 ]
Lee, SWR [1 ]
Ouyang, C [1 ]
机构：
[1] Express Packaging Syst Inc, Palo Alto, CA 94303 USA
来源：
1999 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, PROCEEDINGS | 1999年 / 3906卷
关键词：
imperfect underfill; flip chip; delamination; fracture mechanics; reliability;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The reliability of solder bumped flip chip on printed circuit board (PCB) with a perfect underfill encapsulant has been demonstrated by many researchers. In this study, the effects of delamination crack between the underfill encapsulant and the solder mask on the reliability of solder bumped flip chip on PCB are investigated by a fracture mechanic method. Emphasis is placed on the effects of chip size on the solder joint reliability of flip chip on PCB with perfect and imperfect underfills and without underfill. The energy release rates at the crack tip between the underfill and the solder mask and the inelastic temperature-dependent stress and strains at the corner solder joint for all the cases considered are provided for a better understanding of the thermal-mechanical behavior of the perfect and imperfect underfilled flip chip assemblies.
引用
收藏
页码：592 / 598
页数：7
相关论文
共 50 条
  • [31] Cost analysis: Solder bumped flip chip versus wire bending
    Lau, JH
    IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2000, 23 (01): : 4 - 11
  • [32] Cost analysis: Solder bumped flip chip verses wire bonding
    Lau, J
    Chen, R
    TWENTY THIRD IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM, 1998, : 464 - 472
  • [33] Solder alloy selection for flip chip on board
    Rinne, Glenn A.
    Magill, Paul A.
    Machon, Wayne C.
    Mis, J.Daniel
    Baggs, Joseph W.
    Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces, 1998, : 118 - 122
  • [34] Study on underfill/solder adhesion in flip-chip encapsulation
    Fan, LH
    Tison, CK
    Wong, CP
    IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2002, 25 (04): : 473 - 480
  • [35] Reliability analysis of flip chip on board assemblies using no-flow underfill materials
    Thorpe, R
    Baldwin, DF
    SMTA INTERNATIONAL PROCEEDINGS OF THE TECHNICAL PROGRAM, 1999, : 153 - 158
  • [36] Analysis of underfill encapsulation curing deformations on Flip Chip On Board (FCOB) package reliability
    Pang, JHL
    Tan, TI
    Chong, YR
    Lim, GY
    Wong, CL
    JOURNAL OF ELECTRONICS MANUFACTURING, 1998, 8 (3-4): : 181 - 191
  • [37] Lifetime of solder joint and delamination in flip chip assemblies
    Cheng, ZN
    2004 INTERNATIONAL CONFERENCE ON THE BUSINESS OF ELECTRONIC PRODUCT RELIABILITY AND LIABILITY, PROCEEDINGS, 2004, : 174 - 186
  • [38] Reliability study and failure analysis of fine pitch solder bumped flip chip on low-cost printed circuit board substrate
    Xiao, G
    Chan, PCH
    Teng, A
    Lee, RSW
    Yuen, MMF
    51ST ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2001, : 598 - 605
  • [39] Yield and Reliability in Flip Chip Underfill for Optical Modules
    Benjamin, S.
    Maman, A.
    Decker, U.
    Pleyer, W.
    Luesebrink, H.
    2014 9TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT), 2014, : 73 - 76
  • [40] Reliability studies of flip chip package with reflowable underfill
    Wang, T
    Chew, TH
    Chew, YX
    Foo, L
    PAN PACIFIC MICROELECTRONICS SYMPOSIUM, 2001, PROCEEDINGS, 2001, : 65 - 70
12345