DESIGN OF COMPACT MIC ROWAVE DIPLEXER FOR SYSTEM-IN-A-PACKAGE APPLICATIONS

被引:0
|
作者
Chen, Chi-Feng [1 ]
Wang, Guo-Yun [1 ]
Tseng, Bo-Hao [1 ]
Lin, Ting-An [1 ]
机构
[1] Tunghai Univ, Dept Elect Engn, Taichung 40704, Taiwan
关键词
RESONATOR;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A compact-size and high-isolation microwave diplexer for system-in-a-package has been proposed. By employing the folded stepped-impedance resonators (SIRs), the overall circuit size can be significant reduced. For demonstration, a diplexer operating at 0.5 GHz and 0.86 GHz with third-order Chebyshev bandpass response has been designed and fabricated with microstrip technology. As a result, the diplexer occupies a small size, i.e., 0.14 lambda(g) by 0.12 lambda(g). The measured results are in good agreement with the simulation. The output isolation and out-of-band rejection better than 60 dB are achieved.
引用
收藏
页码:135 / 136
页数:2
相关论文
共 50 条
  • [41] HINTS AND KINKS FOR YOUR MIC PACKAGE DESIGN.
    Lehrfeld, Sanford S.
    Microwaves, 1973, 12 (03): : 62 - 64
  • [42] Thermal-mechanical stress analysis of a silicon-based system-in-a-package
    Goetz, MP
    SOLID STATE TECHNOLOGY, 2000, 43 (07) : 279 - +
  • [43] System-in-a-package integration of SAW RF Rx filter stacked on a transceiver chip
    Jones, RE
    Ramiah, C
    Kamgaing, T
    Banerjee, SK
    Tsai, CT
    Hughes, HG
    De Silva, AP
    Drye, J
    Li, L
    Blood, W
    Li, Q
    Vaughan, CR
    Miglore, R
    Penunuri, D
    Lucero, R
    Frear, DR
    Miller, MF
    IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2005, 28 (02): : 310 - 319
  • [44] Process development and reliability for system-in-a-package using liquid crystal polymer substrate
    Chen, L
    Duo, XZ
    Zheng, LR
    Lai, ZH
    Liu, JH
    54TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2004, : 24 - 28
  • [45] A 1.4 V/5 GHz, 90-nm system-in-a-package LNA
    Banerjee, G
    Bishop, R
    Soumyanath, K
    Allstot, DJ
    2006 IEEE RADIO AND WIRELESS SYMPOSIUM, PROCEEDINGS, 2006, : 35 - 38
  • [46] System in package (SiP) technology: fundamentals, design and applications
    Santagata, Fabio
    Sun, Jianwen
    Iervolino, Elina
    Yu, Hongyu
    Wang, Fei
    Zhang, Guoqi
    Sarro, P. M.
    Zhang, Guoyi
    MICROELECTRONICS INTERNATIONAL, 2018, 35 (04) : 231 - 243
  • [47] Design of a novel compact microstrip diplexer with low insertion loss
    Rezaei, A.
    Noori, L.
    Mohammadi, H.
    MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, 2017, 59 (07) : 1672 - 1676
  • [48] Design of a Compact Lowpass-Bandpass Diplexer with High Isolation
    Elden, Seda
    Gorur, Ali K.
    PROGRESS IN ELECTROMAGNETICS RESEARCH LETTERS, 2021, 97 : 21 - 26
  • [49] Design of compact diplexer using CRLH-TL resonators
    Ono S.
    Kurabeishi F.
    Wada K.
    Journal of Japan Institute of Electronics Packaging, 2020, 23 (06): : 533 - 538
  • [50] Design and Implementation of a Compact LTCC Diplexer at SHF-band
    Qiao, DongChun
    Dai, YongSheng
    Liu, Yi
    9TH INTERNATIONAL CONFERENCE ON MICROWAVE AND MILLIMETER WAVE TECHNOLOGY PROCEEDINGS, VOL. 1, (ICMMT 2016), 2016, : 327 - 329