Thermal-mechanical stress analysis of a silicon-based system-in-a-package

被引：0
|
作者：
Goetz, MP [1 ]
机构：
[1] Alpine Microsyst, Campbell, CA 95008 USA
来源：
SOLID STATE TECHNOLOGY | 2000年 / 43卷 / 07期
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A silicon-based system-in-a-package meets system functional requirements for many applications. A concern with such an approach, though, is the reliability of the solder joints. Presented here is a detailed finite element analysis of the fatigue performance of several solder bump and ball configurations. This analysis identifies the worst-case interconnect locations and allows for evaluation of material and design modifications that improve the integrity of the structure.
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页码：279 / +
页数：5
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