DESIGN OF COMPACT MIC ROWAVE DIPLEXER FOR SYSTEM-IN-A-PACKAGE APPLICATIONS

被引：0

作者：

Chen, Chi-Feng ^{[1
]}

Wang, Guo-Yun ^{[1
]}

Tseng, Bo-Hao ^{[1
]}

Lin, Ting-An ^{[1
]}

机构：

[1] Tunghai Univ, Dept Elect Engn, Taichung 40704, Taiwan

来源：

2016 IEEE INTERNATIONAL CONFERENCE ON CONSUMER ELECTRONICS-TAIWAN (ICCE-TW) | 2016年

关键词：

RESONATOR;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A compact-size and high-isolation microwave diplexer for system-in-a-package has been proposed. By employing the folded stepped-impedance resonators (SIRs), the overall circuit size can be significant reduced. For demonstration, a diplexer operating at 0.5 GHz and 0.86 GHz with third-order Chebyshev bandpass response has been designed and fabricated with microstrip technology. As a result, the diplexer occupies a small size, i.e., 0.14 lambda(g) by 0.12 lambda(g). The measured results are in good agreement with the simulation. The output isolation and out-of-band rejection better than 60 dB are achieved.

引用

页码：135 / 136

页数：2

共 50 条

[31] COMPACT DIPLEXER WITH SLOTLINE RESONATORS FOR WIDEBAND AND WLAN APPLICATIONS
Deng, Hong-wei
Zhao, Yong-jiu
He, Ying
Liu, Hao
Wang, Hong-li
MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, 2014, 56 (11) : 2480 - 2484
[32] A Layout-Aware Test Methodology for Silicon Interposer in System-in-a-Package
Li, Katherine Shu-Min
Ho, Cheng-You
Gu, Ruei-Ting
Wang, Sying-Jyan
Ho, Yingchieh
Huang, Jiun-Jie
Cheng, Bo-Chuan
Liu, An-Ting
2013 22ND ASIAN TEST SYMPOSIUM (ATS), 2013, : 159 - +
[33] System-in-a-package on low-cost liquid crystal polymer substrate
Zou, Gang
Doktorsavhandlingar vid Chalmers Tekniska Hogskola, 2005, (2288): : 1 - 22
[34] Design and fabrication of a novel compact low-loss microstrip diplexer for WCDMA and WiMAX applications
Rezaei A.
Yahya S.I.
Noori L.
Jamaluddin M.H.
Journal of Microwaves, Optoelectronics and Electromagnetic Applications, 2019, 18 (04): : 482 - 491
[35] Design of compact microstrip diplexer with simple coupled resonators
Weng, Min-Hang
Wu, Hung-Wei
Shu, Kevin
MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, 2007, 49 (05) : 1222 - 1225
[36] Design and fabrication of a compact microstrip lowpass-bandpass diplexer with high isolation for telecommunication applications
Moloudian, Gholamhosein
Dousti, Massoud
INTERNATIONAL JOURNAL OF RF AND MICROWAVE COMPUTER-AIDED ENGINEERING, 2018, 28 (05)
[37] Design and analysis of a compact microstrip lowpass-bandpass diplexer with good performance for wireless applications
Rezaei, Abbas
Yahya, Salah I. I.
Nouri, Leila
INTERNATIONAL JOURNAL OF MICROWAVE AND WIRELESS TECHNOLOGIES, 2023, 15 (07) : 1099 - 1107
[38] Area-IO DRAM/logic integration with System-in-a-Package(SiP)
Wang, Anru
Dai, Wayne
ASP-DAC 2005: PROCEEDINGS OF THE ASIA AND SOUTH PACIFIC DESIGN AUTOMATION CONFERENCE, VOLS 1 AND 2, 2005, : 893 - 896
[39] System-in-a-Package Technology for 3D Integration of Radar Modules
Brebels, S.
Sun, X.
Carchon, G.
Posada, G.
Dussopt, L.
Dubois, M. -A.
Vandenbosch, G.
De Raedt, W.
MRRS: 2008 MICROWAVES, RADAR AND REMOTE SENSING SYMPOSIUM, PROCEEDINGS, 2008, : 112 - +
[40] Advancements in Stacked chip scale packaging (S-CSP), provides System-in-a-Package functionality for wireless and handheld applications
Kada, M
Smith, L
FIFTH ANNUAL PAN PACIFIC MICROELECTRONICS SYMPOSIUM, PROCEEDINGS, 2000, : 246 - 251

← 1 2 3 4 5 →