DESIGN OF COMPACT MIC ROWAVE DIPLEXER FOR SYSTEM-IN-A-PACKAGE APPLICATIONS

被引：0

作者：

Chen, Chi-Feng ^{[1
]}

Wang, Guo-Yun ^{[1
]}

Tseng, Bo-Hao ^{[1
]}

Lin, Ting-An ^{[1
]}

机构：

[1] Tunghai Univ, Dept Elect Engn, Taichung 40704, Taiwan

来源：

2016 IEEE INTERNATIONAL CONFERENCE ON CONSUMER ELECTRONICS-TAIWAN (ICCE-TW) | 2016年

关键词：

RESONATOR;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A compact-size and high-isolation microwave diplexer for system-in-a-package has been proposed. By employing the folded stepped-impedance resonators (SIRs), the overall circuit size can be significant reduced. For demonstration, a diplexer operating at 0.5 GHz and 0.86 GHz with third-order Chebyshev bandpass response has been designed and fabricated with microstrip technology. As a result, the diplexer occupies a small size, i.e., 0.14 lambda(g) by 0.12 lambda(g). The measured results are in good agreement with the simulation. The output isolation and out-of-band rejection better than 60 dB are achieved.

引用

页码：135 / 136

页数：2

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