Research on TSV Positioning in 3D IC Placement

被引：0

作者：

Hou, Ligang ^{[1
]}

Bai, Shu ^{[1
]}

Wang, Jinhui ^{[1
]}

机构：

[1] Beijing Univ Technol, VLSI & Syst Lab, Beijing 100124, Peoples R China

来源：

2011 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS SYMPOSIUM (EDAPS) | 2011年

基金：

中国国家自然科学基金;

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper forwards two TSV positioning algorithm named middle-cut positioning (MCP) and optimized area positioning ( OAP). In 3D IC placement, TSV occupies cell area and its position does affect the real wire length which is ignored in previous works. Its effect should be considered by TSV based wirelength calculation and TSV positioning. Experiments are carried out on 2D-3D transformation of IBM benchmark circuits. Results shows that OAP outrun MCP, which optimized total wirelength in 15 out of 17 benchmark circuits, in which best optimized 11.81%

引用

页数：4

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