Strained Germanium-Tin pMOSFET Fabricated on a Silicon-on-Insulator Substrate with Relaxed Ge Buffer

被引:2
|
作者
Su Shao-Jian [1 ]
Han Gen-Quan [2 ]
Zhang Dong-Liang [3 ]
Zhang Guang-Ze [3 ]
Xue Chun-Lai [3 ]
Wang Qi-Ming [3 ]
Cheng Bu-Wen [3 ]
机构
[1] Huaqiao Univ, Coll Informat Sci & Engn, Xiamen 361021, Peoples R China
[2] Chongqing Univ, Coll Optoelect Engn, Educ Minist China, Key Lab Optoelect Technol & Syst, Chongqing 400044, Peoples R China
[3] Chinese Acad Sci, Inst Semicond, State Key Lab Integrated Optoelect, Beijing 100083, Peoples R China
基金
中国国家自然科学基金;
关键词
ELECTRICAL-ACTIVITY; DISLOCATIONS; TECHNOLOGY; MOBILITY; IMPLANT; MOSFETS; SI;
D O I
10.1088/0256-307X/30/11/118501
中图分类号
O4 [物理学];
学科分类号
0702 ;
摘要
Germanium-tin (Ge-1 Sn-x(x)) p-type metal-oxide-semiconductor field effect transistors (pMOSFETs) were fabricated using a strained Ge0.985Sn0.015 thin film that was epitaxially grown on a silicon-on-insulator substrate with a relaxed Ge buffer layer. The Ge buffer was deposited using a two-step chemical vapor deposition growth technique. The high quality Ge0.985Sn0.015 layer was grown by solid source molecular beam epitaxy. Ge0.985Sn0.015 pMOSFETs with Si surface passivation, TaN/HfO2 gate stack, and nickel stanogermanide [Ni(Ge-1-Sn-x(x))] source/drain were fabricated on the grown substrate. The device achieves an effective hole mobility of 182 cm(2)/V.s at an inversion carrier density of 1 x 10(13) cm(-2).
引用
收藏
页数:4
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