A Novel System-in-Package using High-Density Fan-out Technology for Heterogeneous Integration

被引：0
|
作者：
Son, SeungNam [1 ]
Yoo, HoDol [1 ]
Kim, Ji Hyun [1 ]
Kim, JooHyun [1 ]
Lee, DooWon [1 ]
Do, WonChul [1 ]
Ra, Yun [2 ]
So, KwangSup [2 ]
Paik, WooHyun [2 ]
Lee, KangWook [1 ]
机构：
[1] Amkor Technol Korea, Incheon, South Korea
[2] LG Elect Inc, Seoul, South Korea
来源：
2018 IEEE 2ND ELECTRON DEVICES TECHNOLOGY AND MANUFACTURING CONFERENCE (EDTM 2018) | 2018年
关键词：
Fan-out; SiP; SWIFT (R); Package-in-Package; Heterogenous integration;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A new Wafer Level System-in-Package (WLSiP) has been designed and developed where Application Processor (AP), Low Power Double Data Rate 4 (LPDDR4) memory, and Power Management Integrated Circuit (PMIC) semiconductor technologies as well as passive components are integrated using High-Density Fan-Out (HDFO) packaging technology. Compared to current laminate substrate based packaging technology, this solution shows 87% reduction in substrate thickness, 6.7 degrees C lower temperature on the AP chip and 10% enhancement of the electrical performance.
引用
收藏
页码：230 / 232
页数：3
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