A Novel System-in-Package using High-Density Fan-out Technology for Heterogeneous Integration

被引：0

作者：

Son, SeungNam ^{[1
]}

Yoo, HoDol ^{[1
]}

Kim, Ji Hyun ^{[1
]}

Kim, JooHyun ^{[1
]}

Lee, DooWon ^{[1
]}

Do, WonChul ^{[1
]}

Ra, Yun ^{[2
]}

So, KwangSup ^{[2
]}

Paik, WooHyun ^{[2
]}

Lee, KangWook ^{[1
]}

机构：

[1] Amkor Technol Korea, Incheon, South Korea

[2] LG Elect Inc, Seoul, South Korea

来源：

2018 IEEE 2ND ELECTRON DEVICES TECHNOLOGY AND MANUFACTURING CONFERENCE (EDTM 2018) | 2018年

关键词：

Fan-out; SiP; SWIFT (R); Package-in-Package; Heterogenous integration;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A new Wafer Level System-in-Package (WLSiP) has been designed and developed where Application Processor (AP), Low Power Double Data Rate 4 (LPDDR4) memory, and Power Management Integrated Circuit (PMIC) semiconductor technologies as well as passive components are integrated using High-Density Fan-Out (HDFO) packaging technology. Compared to current laminate substrate based packaging technology, this solution shows 87% reduction in substrate thickness, 6.7 degrees C lower temperature on the AP chip and 10% enhancement of the electrical performance.

引用

页码：230 / 232

页数：3

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