Fan-out package substrate wiring technology solution for heterogeneous integration SIP

被引：0
|
作者：
Morikawa Y. [1 ]
机构：
[1] Global Market and Technology Strategy Division, ULVAC, Inc., 2500 Hagisono, Chigasaki, Kanagawa
来源：
Journal of Japan Institute of Electronics Packaging | 2019年 / 22卷 / 05期
关键词：
D O I：
10.5104/jiep.22.405
中图分类号：
学科分类号：
摘要：
[No abstract available]
引用
收藏
页码：405 / 410
页数：5
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