High-Density Fan-Out Technology for Advanced SiP and Heterogeneous Integration

被引：0
|
作者：
Do, WonChul [1 ]
机构：
[1] Amkor Technol Korea Inc, Incheon, South Korea
来源：
2018 IEEE 2ND ELECTRON DEVICES TECHNOLOGY AND MANUFACTURING CONFERENCE (EDTM 2018) | 2018年
关键词：
Fan-out; WLSiP; WL3D; SWIFT (R); MCM;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper reviews the capabilities of high-density fan-out (HDFO) technology for usc in advanced System-in-Package (SiP) and heterogeneous integration and presents Wafer Level SiP (WLSiP) and Wafer Level 3D (WL3D) packages for mobile. Internet-of-Things(IoT) and wearable applications and their extension into large body multi-chip modules (MCMs) targeting networking and server applications. HDFO has extended heterogeneous integration capabilities by creating new toolboxes to be discusscd in this paper.
引用
收藏
页码：138 / 141
页数：4
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