Multigate Ferroelectric Transistor Design Toward 3-nm Technology Node

被引:12
|
作者
Choe, Gihun [1 ]
Yu, Shimeng [1 ]
机构
[1] Georgia Inst Technol, Sch Elect & Comp Engn, Atlanta, GA 30332 USA
关键词
Iron; Logic gates; Transistors; FinFETs; FeFETs; Nanostructures; Semiconductor process modeling; Ferroelectric field-effect transistor (FeFET); ferroelectrics (FEs); FinFET; nanosheets; nonvolatile memory; FUTURE;
D O I
10.1109/TED.2021.3108477
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
An advanced gate-stack design of ferroelectric (FE) transistors has been proposed and investigated for logic compatible program/erase voltage, better scalability, and suppressed depolarization field. The ferroelectric-metal (FeM) FinFET (FeM-FinFET) and stacked nanosheets transistor (FeM-Nanosheet), which have an FE layer on top of the transistor's gate, could adjust the area ratio (AR) between the FE capacitor (A(FE)) and the MOS capacitor (A(MOS)) (AR = A(FE)/A(MOS)) using the floating gate between them, thereby enhancing the electric field on the FE layer. In particular, the proposed FeM-Nanosheet could have the flexibility to lower the operating voltage and depolarization field by increasing the number of nanosheets to reduce the AR.
引用
收藏
页码:5908 / 5911
页数:4
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