Adhesion Property of Polyimide and Passivation Layer for Polymer/metal Wafer-level Hybrid Bonding in 3D Integration

被引：3
|
作者：
Lu, Cheng-Hsien [1 ]
Kho, Yi-Tung [1 ]
Yang, Yu-Tao [1 ]
Chen, Yu-Pei [2 ]
Chen, Chiao-Pei [2 ]
Hung, Tsung-Tai [2 ]
Chen, Chiu-Feng [2 ]
Chen, Kuan-Neng [1 ]
机构：
[1] Natl Chiao Tung Univ, Dept Elect Engn, Hsinchu, Taiwan
[2] Taiflex Sci Corp, Kaohsiung, Taiwan
来源：
2018 IEEE 68TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2018) | 2018年
关键词：
adhesion; four-point bending; polyimide; polyimide-like; hybrid bonding; 3D integration;
D O I：
10.1109/ECTC.2018.00067
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In this paper, the four-point bending method experiments were carried out with different polyimides and passivation layers for realization of adhesion property below 400 degrees C. Three types of passivation layers, thermal oxide, tetraethoxysilane (TEOS) oxide, silicon nitride, and three types of polyimides, with hydrophobic silane, with hydrophilic silane and without silane, and annealing temperature were all considered in this paper. Moreover, the relation between adhesion strength and surface roughness is discussed. Finally, a low thermal budget (250-375 degrees C) polyimide/metal hybrid bonding scheme with good stress release was proposed for future hybrid bonding applications.
引用
收藏
页码：401 / 406
页数：6
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