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- [18] Formation of the Cu6Sn5 Intermetallics in Cu/Sn Thin Films Physics of the Solid State, 2022, 64 : 33 - 37
- [19] Orientation transformation of Cu6Sn5 grains by Ag addition in Cu/Sn-xAg/Cu micro solder joints under temperature gradient Journal of Materials Science, 2023, 58 : 5010 - 5022