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- [41] η-η' Transformation of Interfacial Cu6Sn5 in Solder Joints 2010 11TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP), 2010, : 1097 - 1101
- [43] The Effect of Crystallographic Orientation on the Mechanical Behavior of Cu6Sn5 by Micropillar Compression Testing Journal of Electronic Materials, 2012, 41 : 2083 - 2088
- [45] Effect of ni on the formation of Cu6Sn5 and Cu3Sn intermetallics IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2007, 30 (04): : 293 - 298
- [48] Effect of Ni on the formation of Cu6Sn5 and Cu3Sn intermetallics 56TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE 2006, VOL 1 AND 2, PROCEEDINGS, 2006, : 1204 - +