Formation of the Cu6Sn5 Intermetallics in Cu/Sn Thin Films

被引:0
|
作者
L. E. Bykova
S. M. Zharkov
V. G. Myagkov
Yu. Yu. Balashov
G. S. Patrin
机构
[1] Kirensky Institute of Physics,
[2] Krasnoyarsk Scientific Center,undefined
[3] Siberian Branch,undefined
[4] Russian Academy of Sciences,undefined
[5] Siberian Federal University,undefined
来源
关键词
thin films; Cu; Sn; intermetallic; transmission electron microscopy; electron diffraction;
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
页码:33 / 37
页数:4
相关论文
共 50 条
  • [1] Formation of the Cu6Sn5 Intermetallics in Cu/Sn Thin Films
    Bykova, L. E.
    Zharkov, S. M.
    Myagkov, V. G.
    Balashov, Yu. Yu.
    Patrin, G. S.
    [J]. PHYSICS OF THE SOLID STATE, 2022, 64 (02) : 33 - 37
  • [2] Effect of ni on the formation of Cu6Sn5 and Cu3Sn intermetallics
    Yu, Hao
    Vuorinen, Vesa
    Kivilahti, Jonna
    [J]. IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2007, 30 (04): : 293 - 298
  • [3] Effect of Ni on the formation of Cu6Sn5 and Cu3Sn intermetallics
    Yu, Hao
    Vuorinen, Vesa
    Kivilahti, Jorma
    [J]. 56TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE 2006, VOL 1 AND 2, PROCEEDINGS, 2006, : 1204 - +
  • [4] Growth evolution and formation mechanism of η′-Cu6Sn5 whiskers on η-Cu6Sn5 intermetallics during room-temperature ageing
    Zhang, Z. H.
    Wei, C. W.
    Han, J. J.
    Cao, H. J.
    Chen, H. T.
    Li, M. Y.
    [J]. ACTA MATERIALIA, 2020, 183 : 340 - 349
  • [6] Dissolution and precipitation kinetics of Cu6Sn5 intermetallics in Cu/Sn/Cu micro interconnects under temperature gradient
    Zhao, N.
    Zhong, Y.
    Huang, M. L.
    Ma, H. T.
    Dong, W.
    [J]. INTERMETALLICS, 2016, 79 : 28 - 34
  • [7] Microstructural study of Sn films electrodeposited on Cu substrates: Sn whiskers and Cu6Sn5 precipitates
    A. He
    D. G. Ivey
    [J]. Journal of Materials Science, 2015, 50 : 2944 - 2959
  • [8] Microstructural study of Sn films electrodeposited on Cu substrates: Sn whiskers and Cu6Sn5 precipitates
    He, A.
    Ivey, D. G.
    [J]. JOURNAL OF MATERIALS SCIENCE, 2015, 50 (07) : 2944 - 2959
  • [9] Morphologies of Primary Cu6Sn5 and Ag3Sn Intermetallics in Sn-Ag-Cu Solder Balls
    Mueller, Maik
    Panchenko, Iuliana
    Wiese, Steffen
    Wolter, Klaus-Juergen
    [J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2020, 10 (01): : 18 - 29
  • [10] First-Principles Calculations of Elastic Properties of Cu3Sn and Cu6Sn5 Intermetallics
    Chen, Jiunn
    Lai, Yi-Shao
    Yang, Ping-Feng
    [J]. IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2009, 32 (04): : 754 - 757