Influence of Source/Drain Parasitic Resistance on Device Performance of Ultrathin Body III-V Channel Metal-Oxide-Semiconductor Field-Effect Transistors

被引:3
|
作者
Maegawa, Yosuke [1 ]
Koba, Shunsuke [1 ]
Tsuchiya, Hideaki [1 ,2 ]
Ogawa, Matsuto [1 ]
机构
[1] Kobe Univ, Grad Sch Engn, Dept Elect & Elect Engn, Kobe, Hyogo 6578501, Japan
[2] Japan Sci & Technol Agcy, CREST, Chiyoda Ku, Tokyo 1020075, Japan
基金
日本科学技术振兴机构; 日本学术振兴会;
关键词
MOLECULAR-BEAM EPITAXY; SIMULATION; SI;
D O I
10.1143/APEX.4.084301
中图分类号
O59 [应用物理学];
学科分类号
摘要
The influence of source/drain (S/D) parasitic resistance in ultrathin body (UTB) III-V channel metal-oxide-semiconductor field-effect transistor (MOSFET) was investigated based on Monte Carlo simulation. We found that heavily doped S/D improves source starvation and suppresses carrier's backscattering from drain to channel, owing to increased electron-electron scattering. As a result, the heavily doped S/D was shown to be effective to enhance the current drive and transconductance of UTB III-V channel MOSFET. In addition, we demonstrated that the heavily doped S/D has the advantage to provide unsaturated drain current characteristics. (C) 2011 The Japan Society of Applied Physics
引用
收藏
页数:3
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