Dual-Channel Technology with Cap-free Single Metal Gate for High Performance CMOS in Gate-First and Gate-Last Integration

被引:0
|
作者
Witters, L. [1 ]
Mitard, J. [1 ]
Veloso, A. [1 ]
Hikavyy, A. [1 ]
Franco, J. [4 ]
Kauerauf, T. [1 ]
Cho, M. [1 ]
Schram, T. [1 ]
Sebai, F. [1 ]
Yamaguchi, S. [5 ]
Takeoka, S. [6 ]
Fukuda, M. [7 ]
Wang, W. -E. [1 ]
Duriez, B. [1 ]
Eneman, G. [3 ,4 ]
Loo, R. [1 ]
Kellens, K. [1 ]
Tielens, H. [1 ]
Favia, P. [1 ]
Rohr, E. [1 ]
Hellings, G. [2 ,4 ]
Bender, H. [1 ]
Roussel, P. [1 ]
Crabbe, Y. [1 ]
Brus, S. [1 ]
Mannaert, G. [1 ]
Kubicek, S. [1 ]
Devriendt, K. [1 ]
De Meyer, K. [4 ]
Ragnarsson, L. -A. [1 ]
Steegen, A. [1 ]
Horiguchi, N. [1 ]
机构
[1] IMEC, Kapeldreef 75, B-3001 Heverlee, Belgium
[2] IWT, Brussels, Belgium
[3] FWO Vlaanderen, Brussels, Belgium
[4] Katholieke Univ Leuven, ESAT INSYS, Leuven, Belgium
[5] Sony, Zaventem, Belgium
[6] Panasonic, Asse, Belgium
[7] Fujitsu Semicond, Yokohama, Kanagawa, Japan
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中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper presents for the first time a low-complexity high performance CMOS HK/MG process on planar bulk Si using a single dielectric / single metal gate stack and making use of dual-channel integration. Through the optimization of the Si45Ge55/Si cap deposition and the workfunction metal, high performance devices with balanced V-t,V-sat (+0.12V, -0.16V) at scaled T-inv similar to 1nm and gate length L-g similar to 30nm are reported, leading to 17ps ring oscillators at 1 mu W/stage at Vdd=0.7V. Compatibility with gate last processing is also demonstrated.
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页数:4
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