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- [22] WAFER-LEVEL FAN-OUT FOR HIGH-PERFORMANCE, LOW-COST PACKAGING OF MONOLITHIC RF MEMS/CMOS 2018 INTERNATIONAL WAFER LEVEL PACKAGING CONFERENCE (IWLPC), 2018,
- [23] High Performance Passive Devices for Millimeter Wave System Integration on Integrated Fan-Out (InFO) Wafer Level Packaging Technology 2015 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM), 2015,
- [24] High Throughput Low Stress Air Jetting Carrier Release for RDL-First Fan-Out Wafer-Level-Packaging 2017 IEEE 67TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2017), 2017, : 1748 - 1754
- [25] A Novel System-in-Package using High-Density Fan-out Technology for Heterogeneous Integration 2018 IEEE 2ND ELECTRON DEVICES TECHNOLOGY AND MANUFACTURING CONFERENCE (EDTM 2018), 2018, : 230 - 232
- [26] High-Density Fan-Out Technology for Advanced SiP and 3D Heterogeneous Integration 2018 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS), 2018,
- [27] Reliability Challenges of High-Density Fan-out Packaging for High-Performance Computing Applications IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022), 2022, : 1454 - 1458
- [28] High Speed Signal Design on Fan-Out RDL Interposer for Artificial Intelligence (AI) and Deep Neural Network (DNN) Chiplet Accelerators Application 2024 International Conference on Electronics Packaging, ICEP 2024, 2024, : 275 - 276
- [29] Miniature Heterogeneous Fan-Out Packages for High-Performance, Large-Format Systems 2017 IEEE 67TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2017), 2017, : 1098 - 1106
- [30] Modeling High-Frequency and DC Path of Embedded Discrete Capacitor Connected by Double-Side Terminals with Multi-layered Organic Substrate and RDL-based Fan-out Package IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022), 2022, : 2217 - 2221